IP Library › Granted Patent US 8,950,792
Granted Patent B2
US 8,950,792 · App. 13/803,617 · Granted Feb 10, 2015

Compliant solid-state bumper for robot

Inventors: Stephen A. Hickey (Somerville, MA); Andrew Pastore (Watertown, MA); Chikyung Won (Tewksbury, MA); Roger Dale Gamble (Bedford, MA); Andrew Beaulieu (Watertown, MA)
Assignee: iRobot Corporation
B60R19/483G05D1/0227G05D1/021Y10S901/46
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,950,792
App. No.
13/803,617
Granted
Feb 10, 2015
Kind
B2
Abstract

A robot bumper assembly includes a bumper body, a first sensor array, and a second sensor array. The first sensor array is disposed along and contoured to the periphery of a forward facing portion of the bumper body and senses contact with an external environment at positions along the contour of the periphery forward facing portion of the bumper body. The second sensor array is disposed along and contoured to the periphery of a top portion of the forward facing portion of the robot body. The top portion is angled, ramping up. The second sensor array senses contact with an external environment at positions along the periphery of the angled top portion of the bumper body.

Claims (13)

1. A robot bumper assembly comprising:

a bumper body;

a first sensor array disposed along and contoured to the periphery of a forward facing portion of the bumper body, the first sensor array sensing contact with an external environment at positions along the contour of the periphery forward facing portion of the bumper body; and

a second sensor array disposed along and contoured to the periphery of a top portion of the forward facing portion of the bumper body, the top portion being angled ramping up and the second sensor array sensing contact with an external environment at positions along the periphery of the angled top portion of the bumper body.

2. The robot bumper assembly of claim 1 , wherein the first sensor array extends vertically along a height of the forward facing portion of the bumper body.

3. The robot bumper assembly of claim 1 , further comprising a third sensor array disposed along and contoured to the periphery of a forward facing portion of the bumper body, the third sensor array sensing contact with an external environment at positions along the contour of the periphery of the forward facing portion of the bumper body and being spaced vertically apart from the first sensor array along the forward facing portion of the bumper body.

4. The robot bumper assembly of claim 1 , wherein the first and second sensor arrays are pressure sensitive.

5. The robot bumper assembly of claim 1 , wherein the second sensor array extends vertically along a height of the angled top portion of the bumper body.

6. The robot bumper assembly of claim 1 , wherein the angled top portion is curved.

7. The robot bumper assembly of claim 1 , further comprising a fourth sensor array disposed adjacent the second sensor array along the periphery of the angled top portion of the forward facing portion of the bumper body, the fourth sensor array being contoured to the surface of the angled top portion and sensing contact with an external environment at positions along the periphery of the angled top portion of the bumper body.

8. The robot bumper assembly of claim 1 , wherein the bumper body defines a substantially circular periphery or an at least partially square periphery.

9. The robot bumper assembly of claim 1 , further comprising a non-contact sensor array disposed on the forward facing portion of the bumper body and vertically spaced between the first sensor array and second sensor array.

10. The robot of claim 1 , wherein the first and second sensors arrays are membrane switches comprising first and second conductive layers separated by a separator layer.

Assignments (6)
NOTICE OF ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Nov 25, 2025
From: TCG SENIOR FUNDING L.L.C., AS COLLATERAL AGENT
To: SANTRUM HONG KONG CO., LIMITED, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 073707/0516 →
SECURITY INTEREST Recorded Aug 9, 2023
From: IROBOT CORPORATION
To: TCG SENIOR FUNDING L.L.C., AS COLLATERAL AGENT
Reel/Frame 064532/0856 →
RELEASE OF SECURITY INTEREST Recorded Jul 31, 2023
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: IROBOT CORPORATION
Reel/Frame 064430/0001 →
SECURITY INTEREST Recorded Nov 3, 2022
From: IROBOT CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 061878/0097 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2014
From: BEAULIEU, ANDREW
To: IROBOT CORPORATION
Reel/Frame 034051/0843 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2013
From: HICKEY, STEPHEN A; PASTORE, ANDREW J; WON, CHIKYUNG; GAMBLE, ROGER DALE
To: IROBOT CORPORATION
Reel/Frame 031757/0042 →
Continuity (2)
Provisional Application 61611550 · Mar 15, 2012
Related Publication 20130241217A1 · Sep 19, 2013