Micro- and nanoscale capacitors that incorporate an array of conductive elements having elongated bodies

1. A capacitor that incorporates a conductive element that conforms to the shape of an array of elongated bodies comprising:

a first conductive element that conforms to the shape of an array of elongated bodies;

a second conductive element that conforms to the shape of an array of elongated bodies; and

a dielectric material that is disposed in between the first conductive element and the second conductive element, and thereby physically separates them;

wherein each of a plurality of elongated bodies defined by either the first conductive element or the second conductive element extend into the dielectric material such that the end of a respective elongated body that extends into the dielectric material is surrounded on all sides by the dielectric material

wherein the dielectric material comprises Polybenzimidazole.

2. The capacitor of claim 1 , wherein:

the first conductive element and the second conductive element are distinct structures that are configured to interdigitate, but not physically contact one another.

3. The capacitor of claim 2 , wherein the inter-electrode gap is less than approximately 10 μm.

4. The capacitor of claim 2 , wherein the first conductive element and the second conductive element each conform to the shape of an array of cylinders.

5. The capacitor of claim 2 , wherein the first conductive element and the second conductive element each conform to the shape of an array of hexagonal elongated bodies.

6. The capacitor of claim 2 , wherein the first conductive element and the second conductive element each constitute an array of elongated bodies.

7. The capacitor of claim 1 , wherein the first conductive element and the second conductive element each constitute a coating deposited onto an array of elongated bodies.

8. The capacitor of claim 1 , wherein:

the first conductive element is a layer disposed onto an array of elongated bodies;

the dielectric material is a layer that is disposed onto the first conductive element; and

the second conductive element is a layer that is disposed onto the dielectric material.

9. The capacitor of claim 8 , wherein the array of elongated bodies comprises conductive silicon.

10. The capacitor of claim 9 , wherein the array of elongated bodies comprises a layer of dielectric material disposed onto the conductive silicon.

11. The capacitor of claim 10 , wherein the first conductive element and the second conductive element each comprise TiN.

12. The capacitor of claim 11 , wherein the dielectric material comprises Al 2 O 3 .

13. The capacitor of claim 8 , wherein the array of elongated bodies comprises carbon nanotubes.

14. The capacitor of claim 13 , wherein the array of elongated bodies comprises a silicon oxide layered onto the carbon nanotubes.

15. The capacitor of claim 14 , wherein the first conductive element and the second conductive element each comprise TiN.

16. The capacitor of claim 14 , wherein the dielectric material comprises Al 2 O 3 .

17. The capacitor of claim 16 , further comprising:

a second dielectric material;

a third conductive element;

a third dielectric material;

a fourth conductive element;

a fourth dielectric material; and

a fifth conductive element;

wherein:

the second dielectric material is a layer disposed onto the second conductive element;

the third conductive element is a layer ha is disposed onto the second dielectric material;

the third dielectric material is a layer disposed onto the third conductive element;

the fourth conductive element is a layer that is disposed onto the third dielectric material;

the fourth dielectric material is a layer that is disposed on the fourth conductive element; and

the fifth conductive element is a layer that is disposed onto the fourth dielectric material.

18. The capacitor of claim 1 , wherein the first conductive element, the second conductive element, and the dielectric material have similar coefficients of thermal expansion.

19. The capacitor of claim 1 , wherein the first conductive element, the second conductive element, and the dielectric material allow the capacitor to operate at within a temperature range from approximately 20° C. to 360° C.

20. The capacitor of claim 1 , wherein the dielectric material further comprises polyetheretherketone (PEEK).

21. The capacitor of claim 1 , wherein the dielectric material comprises one of:

Celazole U-60; Celazole U-60SD; Celazole U-60ESD; Celazole TU-60; Celazole TF-60C; Celazole TF-60B; and Celazole TL-60.