Bonding material
Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi 2 O 3 -based glass frit powder having an average particle diameter of 200 μm or less. The bonding material may be formed in a paste form by adding a solvent thereto. This feature makes it possible to bond together substrates having different thermal expansion coefficients without causing a crack or unsticking.
1. A bonding material for bonding between members comprising:
Bi 2 O 3 -based glass frit containing at least Bi 2 O 3 ; and
at least one powder selected from the group consisting of BiSn alloy powder and a metal powder mixture of Bi powder and Sn powder, wherein
the BiSn alloy powder, and/or the metal powder mixture of Bi powder and Sn powder are/is mixed with the Bi 2 O 3 -based glass frit containing at least Bi 2 O 3 in a content ratio of 3 to 60 mass % (to the whole).
2. A bonding material for bonding between members comprising:
Bi 2 O 3 -based glass fit containing at least Bi 2 O 3 ; and
at least one powder selected from the group consisting of BiSnMg alloy powder and a metal powder mixture of Bi powder, Sn powder and Mg powder, wherein
the BiSnMg alloy powder (the content of Mg is 0.1-0.4 mass %), and/or the metal powder mixture of Bi powder, Sn powder and Mg powder (the content of Mg is 0.1-0.4 mass %) are/is mixed with the Bi 2 O 3 -based glass fit containing at least Bi 2 O 3 in a content ratio of 3 to 60 mass % (to the whole).
3. The bonding material according to claim 1 wherein the Bi has a content ratio of 48 to 58 mass %; and the Sn has a content ratio of 42 to 52 mass % in the metal powder mixture or the alloy powder.
4. The bonding material according to claim 1 , wherein the Bi has a content ratio of 35 mass % or less, and the Sn has a content ratio of 65 mass % or more (the content ratio of Sn cannot be 100 mass %) in the metal powder mixture or the alloy powder.
5. A bonding material for bonding between members comprising:
Bi 2 O 3 -based glass frit containing at least Bi 2 O 3 ; Ga; and
at least one powder selected from the group consisting of BiSn alloy powder and a metal powder mixture of Bi powder and Sn powder, wherein
the BiSn alloy powder, and/or the metal powder mixture of Bi powder and Sn powder are/is mixed with the Bi 2 O 3 -based glass frit containing at least Bi 2 O 3 in a content ratio of 3 to 60 mass % (to the whole); and the Ga is further mixed in a content ratio of 0.01 to 3 mass % (to the whole).
6. The bonding material according to claim 1 or 2 , wherein the bonding material is mixed with a solvent into a paste.
7. The bonding material according to claim 1 or 2 , wherein the metal powder or alloy powder has an average particle diameter of 100 μm or less.
8. The bonding material according, to claim 1 or 2 , wherein the Bi 2 O 3 -based glass fit containing at least Bi 2 O 3 has an average particle diameter of 200 μm or less.
9. A bonding material for bonding between members comprising Bi 2 O 3 -based glass frit containing at least Bi 2 O 3 , wherein the
Bi 2 O 3 -based glass fit containing at least Bi 2 O 3 contains 45 to 90 mass % of Bi 2 O 3 with the balance including SiO 2 , Bi 2 O 3 , Al 2 O 3 , ZnO and MgO; and
at least one powder selected from the group consisting of BiSn alloy powder, BiSnMg alloy powder, a metal powder mixture of Bi powder and Sn powder and a metal powder mixture of Bi powder, Sn powder and Mg powder; and/or Ga metal,
wherein the powder and/or the Ga metal are included in a content ratio of 0.01 to 60 mass % (to the whole).
10. The bonding material according to claim 2 , wherein the Bi has a content ratio of 48 to 58 mass %, and the Sn has a content ratio of 42 to 52 mass % in the metal powder mixture or the alloy powder.
11. The bonding material according to claim 2 , wherein the Bi has a content ratio of 35 mass % or less, and the Sn has a content ratio of 65 mass % or more (the content ratio of Sn cannot be 100 mass %) in the metal powder mixture or the alloy powder.
12. The bonding material according to claim 2 , wherein the Ga is further mixed in a content ratio of 0.01 to 3 mass %.