Droplet actuator assemblies and methods of making same
The invention provides droplet actuator assemblies and systems and methods of manufacturing the droplet actuator assemblies. In certain embodiments, two-piece enclosures are used to form a droplet actuator assembly that houses a droplet operations substrate. In certain other embodiments, one-piece enclosures are used to form a droplet actuator assembly that houses a droplet operations substrate. In the plastic injection molding process for forming substrates of the droplet actuator assemblies of the present invention may utilize insert molding (or overmolding) processes for forming a gasket in at least one substrate, thereby avoiding the need for providing and installing a separate gasket component. Further, the droplet actuator assemblies may include features that allow ultrasonic welding processes to be used for bonding substrates together. The manufacturing systems of the present invention for fabricating the droplet actuator assemblies may utilize continuous flow reel-to-reel manufacturing processes.
1. A droplet actuator, comprising:
(a) a droplet operations substrate having droplet operations electrodes arranged on a side thereof and a top substrate separated by a gap when assembled;
(b) one or more gap setting features provided between the droplet operations substrate and the top substrate; and
(c) one or more bonding features formed on the gap facing side of the top substrate.
2. The droplet actuator of claim 1 wherein the one or more bonding features comprise block-shaped features having energy director features formed thereon.
3. The droplet actuator of claim 1 wherein the droplet operations substrate comprises a PCB.
4. The droplet actuator of claim 1 wherein the top substrate comprises one of PC, MDH12, COP, COC, and/or thermoplastic.
5. The droplet actuator of claim 1 wherein the droplet operations electrodes comprise electrowetting electrodes.
6. The droplet actuator of claim 1 further comprising a dielectric layer formed on the droplet operations substrate.
7. The droplet actuator of claim 6 wherein the dielectric layer and the top substrate comprise the same material.
8. The droplet actuator of claim 1 wherein the top substrate is ultrasonically welded to the droplet operations substrate such that the gap-setting features do not melt during the ultrasonic welding process.
9. The droplet actuator of claim 1 further comprising a bottom substrate wherein the droplet operations substrate is atop the bottom substrate.
10. The droplet actuator of claim 9 wherein the bottom substrate comprises one of PC, MDH12, COP, COC, and/or thermoplastic.
11. The droplet actuator of claim 9 further comprising one or more openings in the droplet operations substrate that substantially correspond with the one or more bonding features such that the one or more bonding features pass through droplet operations substrate and make contact with the bottom substrate.
12. The droplet actuator of claim 11 wherein the top substrate is ultrasonically welded to the bottom substrate by the one or more bonding features.