Method for depositing cyclic thin film
Provided is a method of depositing a cyclic thin film that can provide excellent film properties and step coverage. The method comprises the steps of forming a silicon thin film by repeating a silicon deposition step for depositing silicon on a substrate by injecting a silicon precursor into a chamber into which the substrate is loaded and a first purge step for removing a non-reacted silicon precursor and a reacted byproduct from the chamber; and forming the insulating film including silicon from the silicon thin film by forming a plasma atmosphere into the chamber.
1. A method of depositing a cyclic thin film, the method comprising:
repeating a silicon deposition step at least two times consecutively for forming a silicon thin film on a substrate, the silicon deposition step including
injecting a silicon precursor into a chamber in which the substrate is loaded, so that a silicon layer is formed on the substrate, and
first purging for removing a non-reacted silicon precursor and a reacted byproduct from the chamber,
whereby the silicon thin film is formed to include a plurality of silicon layers and has excellent film properties and step coverage; and
after repeating the silicon deposition step at least two times consecutively, performing an insulating film forming step for forming an insulating film from the silicon thin film by forming a plasma atmosphere into the chamber.
2. The method of claim 1 , wherein the insulating film forming step comprises injecting one or more reacting gases selected from a group consisting of O2, O3, N2, and NH3.
3. The method of claim 2 , wherein the insulating film is a silicon oxide film or a silicon nitride film.
4. The method of claim 1 , wherein the insulating film is a silicon oxide film or a silicon nitride film.
5. The method of claim 1 , wherein the plasma atmosphere is formed by injecting one or more ignition gases selected from a group consisting of Ar, He, Kr, and Xe.
6. The method of claim 5 , wherein the ignition gases are injected at a flow rate of 100 to 3000 sccm, and the reaction gases are injected at flow a rate of 10 to 500 sccm.
7. The method of claim 1 , wherein the plasma atmosphere is formed by using O2 or O3 as the ignition gas.
8. The method of claim 1 , further comprising a second purging step for removing reacted byproducts from the chamber after the insulating film forming step, wherein the silicon deposition step, the insulating film forming step and the second purging step are repeated in order.
9. The method of claim 1 , the silicon deposition step is performed while maintaining a pressure inside the chamber as 0.05 Torr to 10 Torr.
10. The method of claim 1 , wherein the insulating film forming step is performed while maintaining a pressure inside the chamber as 0.05 Torr to 10 Torr.
11. The method of claim 1 , wherein the silicon thin film comprises amorphous silicon or polysilicon having polycrystalline property.