IP Library › Granted Patent US 8,735,905
Granted Patent B2
US 8,735,905 · App. 13/809,261 · Granted May 27, 2014

Method for producing aluminum nitride crystals

Inventors: Hiroyuki Fukuyama (Miyagi, JP); Masayoshi Adachi (Miyagi, JP); Akikazu Tanaka (Tokyo, JP); Kazuo Maeda (Tokyo, JP)
Assignees: Sumitomo Metal Mining Co., Ltd.; Tohoku University
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Quick Facts
Patent No.
US 8,735,905
App. No.
13/809,261
Granted
May 27, 2014
Kind
B2
Abstract

Provided is a method for producing inexpensive and high-quality aluminum nitride crystals. Gas containing N atoms is introduced into a melt of a Ga—Al alloy, whereby aluminum nitride crystals are made to epitaxially grow on a seed crystal substrate in the melt of the Ga—Al alloy. A growth temperature of aluminum nitride crystals is set at not less than 1000 degrees C. and not more than 1500 degrees C., thereby allowing GaN to be decomposed into Ga metal and nitrogen gas.

Claims (10)

1. A method for producing aluminum nitride crystals, the method comprising:

introducing gas containing N atoms into a melt of a Ga—Al alloy; and

epitaxially growing aluminum nitride crystals on a seed crystal substrate in said melt of the Ga—Al alloy.

2. The method for producing aluminum nitride crystals according to claim 1 , wherein the above-mentioned seed crystal substrate is a nitrided sapphire substrate.

3. The method for producing aluminum nitride crystals according to claim 2 , wherein the above-mentioned nitrided sapphire substrate is annealed at a temperature of not less than 900 degrees C. and not more than 1500 degrees C.

4. The method for producing aluminum nitride crystals according to claim 2 , wherein aluminum nitride crystals having aluminum polarity are made to epitaxially grow on a aluminum nitride film having nitrogen polarity and being formed on the above-mentioned nitrided sapphire substrate.

5. The method for producing aluminum nitride crystals according to claim 1 , wherein, with introducing N 2 gas into the above-mentioned melt of the Ga—Al alloy, aluminum nitride crystals are made to epitaxially grow.

6. The method for producing aluminum nitride crystals according to claim 1 , wherein, a temperature of the above-mentioned melt of the Ga—Al alloy is set at not less than 1000 degrees C. and not more than 1500 degrees C. to epitaxially grow aluminum nitride crystals.

7. The method for producing aluminum nitride crystals according to claim 1 , wherein, a molar ratio of Ga to Al of the above-mentioned melt of the Ga—Al alloy is 98:2 to 40:60.

8. A crystal substrate, wherein aluminum nitride crystals having aluminum polarity are made to epitaxially grow on an aluminum nitride film having nitrogen polarity and being formed on a nitrided sapphire substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2013
From: FUKUYAMA, HIROYUKI; ADACHI, MASAYOSHI; TANAKA, AKIKAZU; MAEDA, KAZUO
To: SUMITOMO METAL MINING CO., LTD.; TOHOKU UNIVERSITY
Reel/Frame 029921/0475 →
Priority Claims (3)
JP 2010-159973 · Jul 14, 2010 · national
JP 2011-012770 · Jan 25, 2011 · national
JP 2011-050415 · Mar 8, 2011 · national
Continuity (1)
Related Publication 20130187170A1 · Jul 25, 2013