Method for disposing fine objects, apparatus for arranging fine objects, illuminating apparatus and display apparatus
This method for disposing fine objects, in a substrate preparing step, prepares a substrate having specified positions where fine objects ( 120 ) are to be disposed in an area where a first electrode ( 111 ) and a second electrode ( 112 ) face each other, and in a fluid introducing step, a fluid ( 121 ) is introduced on the substrate ( 110 ). The fluid ( 121 ) contains a plurality of the fine objects ( 120 ). The fine objects ( 120 ) are diode elements, each of which has, as an alignment structure, a front side layer ( 130 ) composed of a dielectric material, and a rear side layer ( 131 ) composed of a semiconductor. In the fine object disposing step, by applying an AC voltage to between the first electrode ( 111 ) and the second electrode ( 112 ), the fine objects ( 120 ) are disposed by dielectrophoresis with the front side layer ( 130 ) facing up at the predetermined positions in the area (A) where the first electrode ( 111 ) and the second electrode ( 112 ) face each other.
1. A method for disposing fine objects, comprising:
a substrate preparing step for preparing a substrate in which positions where fine objects are disposed are defined, the fine objects having a maximum physical dimension of 100 μm or smaller;
a fluid introducing step for introducing a fluid containing the fine objects onto the substrate; and
a fine object disposing step for disposing the fine objects, which are contained in the fluid introduced onto the substrate, in a predetermined orientation at predetermined positions on the substrate by electromagnetic force, wherein
the fine objects respectively include a plurality of portions mutually differing in at least one of physical properties and shapes;
further, at least the fine objects include an alignment structure configured to dispose the fine objects on the substrate so that the fine objects are aligned in a predetermined orientation defined by disposition of the plurality of portions, which mutually differ in at least one of physical properties and shapes, relative to the substrate;
in the substrate preparing step, a substrate on which a first electrode and a second electrode have previously been formed is prepared;
the first electrode and the second electrode are covered with an insulating film;
in the fine object disposing step, a voltage is applied between the first electrode and the second electrode formed on the substrate so that the fine objects are disposed in a predetermined orientation and at predetermined positions in areas where the first electrode and the second electrode face each other;
the substrate has only a continuous flat planar surface without any recess or protrusion defined therein or thereon;
the first electrode and the second electrode are electrically connected to a voltage source so as to be able to apply the voltage between the first electrode and the second electrode; and
only the first electrode and the second electrode are provided on the continuous flat planar surface of the substrate.
2. The method for disposing fine objects as claimed in claim 1 , wherein
the fine objects each include a front side portion and a rear side portion mutually differing in dielectric constant, and
the front side portion and the rear side portion define the alignment structure.
3. The method for disposing fine objects as claimed in claim 2 , wherein
out of the front side portion and the rear side portion of the fine objects, one portion is formed from metal, and the other portion is formed from a semiconductor.
4. The method for disposing fine objects as claimed in claim 2 , wherein
out of the front side portion and the rear side portion of the fine objects, one portion is formed from a semiconductor and the other portion is formed from a dielectric material.
5. The method for disposing fine objects as claimed in claim 2 , wherein
in the fine object disposing step,
the fluid containing the fine objects introduced onto the substrate is made to flow relative to the substrate.
6. The method for disposing fine objects as claimed in claim 2 , wherein
a plurality of the predetermined positions are defined on the substrate, and a plurality of the fine objects are disposed on the substrate.
7. The method for disposing fine objects as claimed in claim 2 , wherein
the fine object disposing step includes using an arranging apparatus to dispose the fine objects onto the substrate, the arranging apparatus comprising:
a fluid introducing section arranged to introduce the fluid containing the fine objects onto the substrate; and
an electromagnetic force applying section arranged to apply electromagnetic force to the substrate.
8. An illuminating apparatus which is fabricated by using the method for disposing fine objects as claimed in claim 2 , wherein each of the fine objects is a light emitting diode.
9. A display apparatus which is fabricated by using the method for disposing fine objects as claimed in claim 2 , wherein each of the fine objects is a light emitting diode.
10. The method for disposing fine objects as claimed in claim 1 , wherein
the fine objects each include two portions of mutually different sizes corresponding to the first electrode and the second electrode, respectively, in the predetermined positions,
in the substrate:
facing portions of the first electrode and facing portions of the second electrode face each other in areas where the first electrode and the second electrode face each other, and a width of each facing portion of the first electrode and a width of each facing portion of the second electrode are different from each other,
two portions of the fine objects mutually differing in sizes form an alignment structure of the fine objects, and
the facing portions of the first electrode and the facing portions of the second electrode, which mutually differ in width, define an alignment structure of the substrate.
11. The method for disposing fine objects as claimed in claim 10 , wherein
the fine objects each include a front side portion and a rear side portion mutually differing in dielectric constant and further have two portions of mutually different sizes corresponding to the first electrode and the second electrode, respectively, in the predetermined positions,
in the substrate,
facing portions of the first electrode and facing portions of the second electrode face each other in areas where the first electrode and the second electrode face each other, and a width of each facing portion of the first electrode and a width of each facing portion of the second electrode are different from each other,
the front side portion and the rear side portion of the fine objects mutually differing in dielectric constant as well as the two portions mutually differing in sizes form an alignment structure of the fine objects, and
the facing portions of the first electrode and the facing portions of the second electrode, which mutually differ in width, define an alignment structure of the substrate.
12. The method for disposing fine objects as claimed in claim 1 , wherein
the alignment structure of the fine objects includes a magnetized ferromagnet, and
in the fine object disposing step, the fine objects are aligned in the predetermined orientation by an external magnetic field.
13. The method for disposing fine objects as claimed in claim 12 , wherein
the external magnetic field is directed generally parallel to a surface of the substrate.
14. The method for disposing fine objects as claimed in claim 12 , wherein
the external magnetic field is directed generally vertical to a surface of the substrate.
15. The method for disposing fine objects as claimed in claim 1 , wherein
the alignment structure of the fine objects includes a magnetized ferromagnet, and
the substrate also includes an alignment structure, and the alignment structure of the substrate is that a magnetized ferromagnet arranged in correspondence to each of predetermined positions on the substrate.
16. The method for disposing fine objects as claimed in claim 1 , wherein
the front side portion and the rear side portion define the alignment structure; and
each of the fine objects is configured such that a quantity of electric charge induced on the fine object when the front side portion of the fine object faces the first electrode and the second electrode is different from a quantity of electric charge induced on the fine object when the rear side portion of the fine object faces the first electrode and the second electrode in a case that the fine object is disposed at the predetermined position on the first electrode and the second electrode to which voltages are applied in the fine object disposing step.
17. The method for disposing fine objects as claimed in claim 1 , wherein
a distance between facing portions of the first electrode and the second electrode is set to 60% to 90% of a length of the fine object in a longitudinal direction.
18. A method for disposing fine objects, comprising:
a substrate preparing step for preparing a substrate in which positions where fine objects are disposed are defined, the fine objects having a maximum physical dimension of 100 μm or smaller;
a fluid introducing step for introducing a fluid containing the fine objects onto the substrate; and
a fine object disposing step for disposing the fine objects, which are contained in the fluid introduced onto the substrate, in a predetermined orientation at predetermined positions on the substrate by electromagnetic force; wherein
the fine objects respectively include a plurality of portions mutually differing in at least one of physical properties and shapes;
further, at least the fine objects include an alignment structure configured to dispose the fine objects on the substrate so that the fine objects are aligned in a predetermined orientation defined by disposition of the plurality of portions, which mutually differ in at least one of physical properties and shapes, relative to the substrate;
the substrate is a transparent substrate and a semiconductor film is formed on one surface of the transparent substrate;
in the substrate preparing step, light whose incidence region is set to a certain pattern is caused to be incident on the other surface of the transparent substrate, so that while the light keeps incident, portions of the semiconductor film on which the light is incident are selectively lowered in resistance, whereby the selectively lowered-in-resistance portions of the semiconductor film are formed as a first electrode and a second electrode, and
in the fine object disposing step, a voltage is applied between the first electrode and the second electrode formed on the substrate so that the fine objects are disposed in the predetermined orientation and at the predetermined positions in areas where the first electrode and the second electrode face each other.
19. The method for disposing fine objects as claimed in claim 18 , wherein
the alignment structure of the fine objects includes a magnetized ferromagnet, and
in the fine object disposing step, the fine objects are aligned in the predetermined orientation by an external magnetic field.
20. A method for disposing fine objects, comprising:
a substrate preparing step for preparing a substrate in which positions where fine objects are disposed are defined, the fine objects having a maximum physical dimension of 100 μm or smaller;
a fluid introducing step for introducing a fluid containing the fine objects onto the substrate; and
a fine object disposing step for disposing the fine objects, which are contained in the fluid introduced onto the substrate, in a predetermined orientation at predetermined positions on the substrate by electromagnetic force; wherein
the fine objects respectively include a plurality of portions mutually differing in at least one of physical properties and shapes;
further, at least the fine objects include an alignment structure configured to dispose the fine objects on the substrate so that the fine objects are aligned in a predetermined orientation defined by disposition of the plurality of portions, which mutually differ in at least one of physical properties and shapes, relative to the substrate;
the fine objects each include a magnetized ferromagnetic material;
the substrate includes a magnetic field generating portion, the magnetic field generating portion including coils defined by a multilayer interconnection structure provided on the substrate, wherein each interconnection of the multilayer interconnection structure is connected to each other by a contact;
the ferromagnetic material defines an alignment structure of the fine objects and the magnetic field generating portion defines an alignment structure of the substrate; and
in the fine object disposing step, by a magnetic field generated by the magnetic field generating portion, the fine objects are disposed in the predetermined orientation and at the predetermined positions defined by areas where the magnetic field is generated by the magnetic field generating portion.