Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
The present invention relates to a solid-state imaging device having good focusing properties, a method for manufacturing such a solid-state imaging device, and an electronic apparatus. The solid-state imaging device has a semiconductor substrate 11 and a photoelectric conversion part formed in the semiconductor substrate 11 . In the solid-state imaging device, a laminate including an organic material layer and an inorganic material layer is formed on the semiconductor substrate with at least one stress relaxation layer 22 interposed between the organic and inorganic material layers. This technology is applicable to, for example, solid-state imaging devices having pixels and microlenses placed thereon.
1. A solid-state imaging device comprising:
a semiconductor substrate;
a photoelectric conversion part formed in the semiconductor substrate;
a laminate including an organic material layer and an inorganic material layer placed on the semiconductor substrate; and
at least one stress relaxation layer interposed between the organic material layer and the inorganic material layer.
2. The solid-state imaging device according to claim 1 , wherein the stress relaxation layer has a film stress that is different from and between a film stress of the organic material layer and a film stress of the inorganic material layer.
3. The solid-state imaging device according to claim 2 , wherein the organic material layer is a planarizing layer, and the inorganic material layer is a microlens layer.
4. The solid-state imaging device according to claim 1 , wherein the stress relaxation layer comprises at least one material selected from SiO, SiN, and a silicon compound represented by the compositional formula SiO X N Y , where 0<X≦1 and 0<Y≦1.
5. The solid-state imaging device according to claim 1 , wherein the stress relaxation layer has a refractive index of 1.4 to 2.0.
6. A method for manufacturing a solid-state imaging device, comprising the steps of:
forming a photoelectric conversion part in a semiconductor substrate; and
forming a laminate including an organic material layer and an inorganic material layer on the semiconductor substrate with at least one stress relaxation layer interposed between the organic material layer and the inorganic material layer.
7. An electronic apparatus comprising:
a solid-state imaging device comprising a semiconductor substrate, a photoelectric conversion part formed in the semiconductor substrate, a laminate including an organic material layer and an inorganic material layer placed on the semiconductor substrate, and at least one stress relaxation layer interposed between the organic material layer and the inorganic material layer;
an optical system for guiding incident light to an imaging part of the solid-state imaging device; and
a signal processing circuit for processing an output signal from the solid-state imaging device.