Device housing package and electronic apparatus employing the same
A device housing package includes a base body ( 1 ) including, at its upper surface, a placement portion ( 1 a ) of a semiconductor device ( 9 ); a frame body ( 2 ) disposed on the base body ( 1 ) surrounding the placement portion ( 1 a ), including a notch ( 2 b ) formed by cutting a side wall thereof; an input-output terminal ( 3 ) attached to the notch ( 2 b ), including a wiring conductor layer ( 3 a ) electrically connected to the semiconductor device ( 9 ); and a sealing ring ( 5 ) disposed on an upper portion of the frame body ( 2 ). Moreover, side walls of the frame body ( 2 ) have, when seen in a plan view, an outer corner ( 2 c ) of adjacent side walls having a curved surface, the outer corner ( 2 c ) lying within a region overlapping the sealing ring ( 5 ) as seen in a plan view.
1. A device housing package, comprising:
a base body comprising, at its upper surface, a placement portion of a semiconductor device;
a frame body disposed on the base body surrounding the placement portion, comprising a notch disposed in a side wall thereof;
an input-output terminal attached to the notch, comprising a wiring conductor layer electrically connected to the semiconductor device; and
a sealing ring disposed on an upper portion of the frame body, the sealing ring having a rectangular frame-like outer shape as seen in a plan view,
the frame body including four side walls and having, when seen in a plan view, a rectangular frame-like outer shape, an outer corner of adjacent side walls of the four side walls being curved as seen in a plan view,
an inner corner of the adjacent side walls being curved as seen in a plan view, the outer corner lying within a region overlapping the sealing ring as seen in a plan view, the inner corner being exposed in a region surrounded by the sealing ring as seen in a plan view, and
a radius of curvature of an inner corner of the sealing ring being smaller than a radius of curvature of the inner corner of the adjacent side walls of the frame body.
2. The device housing package according to claim 1 , wherein, of the side walls of the frame body, a side wall adjacent to the side wall having the notch is disposed in a manner such that an outer shape of the frame body coincides with the rectangular frame-like outer shape of the sealing ring as seen in a plan view.
3. An electronic apparatus, comprising:
the device housing package according to claim 1 ;
a semiconductor device disposed in the placement portion of the device housing package; and
a lid body disposed on the sealing ring of the device housing package.