Semiconductor light emitting diode having ohmic electrode structure and method of manufacturing the same

1. A semiconductor light emitting diode, comprising:

a light emitting structure comprising an upper surface comprising an N-face; and

an ohmic electrode structure arranged on the light emitting structure, the ohmic electrode structure comprising:

a contact layer arranged on the N-face of the light emitting structure;

a protective layer arranged on the contact layer;

a lower diffusion preventing layer disposed between the contact layer and the N-face of the light emitting structure; and

an upper diffusion preventing layer disposed between the contact layer and the protective layer,

wherein:

the lower diffusion preventing layer comprises at least one of Mo and W;

the contact layer comprises at least one of Ti, TiN, a Ti—Ni alloy, Ta, and a W—Ti alloy;

the upper diffusion preventing layer comprises a metal layer comprising at least one of W, Cr, Ru, Pt, Ni, Pd, Ir, Rh, and Nb, or an oxide film comprising at least one of RuOx, NiOx, IrOx, RhOx, NbOx, TiOx, TaOx, CrOx, and WOx; and

the protective layer comprises Al.

2. The semiconductor light emitting diode according to claim 1 , wherein the lower diffusion preventing layer comprises a Mo layer or a W layer.

3. The semiconductor light emitting diode according to claim 1 , wherein the contact layer comprises a Ti layer.

4. The semiconductor light emitting diode according to claim 1 , wherein the contact layer comprises Ti and the upper diffusion preventing layer comprises W.

5. The semiconductor light emitting diode according to claim 1 , wherein the lower diffusion preventing layer has a thickness of 1 Å to 10 Å.

6. The semiconductor light emitting diode according to claim 1 , wherein the contact layer has a thickness of 10 Å to 50 Å.

7. The semiconductor light emitting diode according to claim 1 , wherein the upper diffusion preventing layer has a thickness of 100 Å to 1000 Å.

8. The semiconductor light emitting diode according to claim 1 , wherein the light emitting structure comprises an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, and the ohmic electrode structure is arranged on the n-type semiconductor layer.

9. The semiconductor light emitting diode according to claim 8 , further comprising an ohmic electrode contacting the p-type semiconductor layer.

10. The semiconductor light emitting diode according to claim 1 , wherein the lower diffusion preventing layer contacts the N-face of the light emitting structure, the contact layer contacts the lower diffusion preventing layer, the upper diffusing preventing layer contacts the contact layer, and the Al protective layer contacts the upper diffusing preventing layer.

11. A method of manufacturing a semiconductor light emitting diode, the method comprising:

forming a light emitting structure comprising an upper surface comprising an N-face; and

forming an ohmic electrode structure on the N-face of the light emitting structure, the ohmic electrode structure comprising a lower diffusion preventing layer, a contact layer, an upper diffusion preventing layer, and a protective layer,

wherein:

the lower diffusion preventing layer comprises at least one of Mo and W;

the contact layer comprises at least one of Ti, TiN, a Ti—Ni alloy, Ta, and a W—Ti alloy;

the upper diffusion preventing layer comprises a metal layer formed of at least one of W, Cr, Ru, Pt, Ni, Pd, Ir, Rh, and Nb, or an oxide film formed of at least one of RuOx, NiOx, IrOx, RhOx, NbOx, TiOx, TaOx, CrOx, and WOx; and

the protective layer is formed of Al.

12. The method according to claim 11 , wherein the contact layer comprises Ti.

13. The method according to claim 12 , wherein the upper diffusion preventing layer comprises W.

14. The method according to claim 11 , further comprising: surface-treating the light emitting structure before forming the ohmic electrode structure.

15. The method according to claim 14 , wherein the surface treatment comprises dipping a surface of the light emitting structure in aqua regia, followed by washing the surface of the light emitting structure using deionized water, and drying the surface of the light emitting structure using nitrogen.

16. The method according to claim 11 , further comprising: heat-treating the ohmic electrode structure.

17. The method according to claim 16 , wherein the heat treatment is performed at a temperature of 150° C. to 600° C.

18. The method according to claim 11 , wherein forming the ohmic electrode structure comprises:

forming the lower diffusion preventing layer on the N-face of the light emitting structure;

forming the contact layer on the lower diffusion preventing layer;

forming the upper diffusion preventing layer on the contact layer; and

forming the protective layer on the upper diffusion preventing layer.