Die tool, device and method for producing a lens wafer

1. A method for the production of a monolithic lens wafer having a large number of microlenses, said method including the following steps, with the following sequence:

oppositely arranging and fixing first and second dies to respective first and second holding systems, the first and second dies having first and second embossing sides, respectively;

at least roughly orienting the first and second dies to one another in the X- and Y-directions and around an axis of rotation;

applying a curable fluid on one of the first and second embossing sides of said first and second dies, respectively; and

embossing the lens wafer by shaping and subsequent curing of the curable fluid, the shaping comprising moving the second die toward the first die via wedge error compensation means without contacting the first die during the embossing;

wherein a wedge error compensation for parallel orientation of the first and second embossing sides is performed using said wedge error compensation means during said moving of the second die and/or during the embossing.

2. The method according to claim 1 , wherein the embossing is carried out based on force and/or position.

3. A method for the production of a monolithic lens wafer having a large number of microlenses, said method including the following steps, with the following sequence:

oppositely arranging and fixing first and second dies to respective first and second holding systems, the first and second dies having first and second embossing sides, respectively, at least one of the first and second embossing sides having a projection that projects therefrom, the projection at least partially bordering an embossing space circumferentially;

at least roughly orienting the first and second dies to one another in the X- and Y-directions and around an axis of rotation;

applying a curable fluid on one of the first and second embossing sides of said first and second dies, respectively;

performing a wedge error compensation using wedge error compensating means for parallel orientation of the first and second embossing sides; and

embossing the lens wafer in the embossing space by shaping and subsequent curing of the curable fluid, the shaping comprising moving the first and second dies to an embossing position at which, throughout the embossing, a projecting face of the projection opposes a face of one of the embossing sides from a distance.

4. The method according to claim 3 , wherein the projection is comprised of a bank.

5. The method according to claim 3 , wherein the first die has a plurality of first embossing structures that corresponds to a negative of a top side of a lens wafer,

wherein at least two inside orientation marks are arranged in an area of the first embossing structures, and

wherein at least two outside orientation marks are provided outside of the area of the first embossing structures.

6. The method according to claim 3 , wherein at least two outside orientation marks are provided in the projection.

7. A method for the production of a monolithic lens wafer having a large number of microlenses, said method including the following steps, with the following sequence:

oppositely arranging and fixing first and second dies to respective first and second holding systems, the first and second dies having first and second embossing sides, respectively, the first and second embossing sides respectively having first and second projections that respectively project therefrom, the first and second projections at least partially bordering respective embossing spaces of the first and second embossing sides circumferentially;

at least roughly orienting the first and second dies to one another in the X- and Y-directions and around an axis of rotation;

applying a curable fluid on one of the first and second embossing sides of said first and second dies, respectively;

performing a wedge error compensation using wedge error compensating means for parallel orientation of the first and second embossing sides; and

embossing the lens wafer in the embossing spaces by shaping and subsequent curing of the curable fluid, the shaping comprising moving the first and second dies to an embossing position at which, throughout the embossing, respective projecting faces of the first and second projections oppose each other from a distance.

8. The method according to claim 1 , wherein said wedge fault equalization means is comprised of a plurality of individually movable actuators configured to move the second die toward the first die and orient the first and second embossing sides parallel to each other during the moving of the second die and/or during the embossing.