Metal assisted chemical etching to produce III-V semiconductor nanostructures
Methods of metal assisted chemical etching III-V semiconductors are provided. The methods can include providing an electrically conductive film pattern disposed on a semiconductor substrate comprising a III-V semiconductor. At least a portion of the III-V semiconductor immediately below the conductive film pattern may be selectively removed by immersing the electrically conductive film pattern and the semiconductor substrate into an etchant solution comprising an acid and an oxidizing agent having an oxidation potential less than an oxidation potential of hydrogen peroxide. Such methods can form high aspect ratio semiconductor nanostructures.
1. A method of metal assisted chemical etching, the method comprising:
providing an electrically conductive film pattern disposed on a semiconductor substrate, the semiconductor substrate comprising a III-V semiconductor; and
selectively removing at least a portion of the III-V semiconductor immediately below the conductive film pattern by immersing the electrically conductive film pattern and the semiconductor substrate into an etchant solution comprising an acid and an oxidizing agent having an oxidation potential less than an oxidation potential of hydrogen peroxide.
2. The method of claim 1 , wherein the etchant solution does not remove substantial portions of the III-V semiconductor which do not have the conductive film pattern disposed thereon.
3. The method of claim 1 , wherein the III-V semiconductor comprises GaAs.
4. The method of claim 1 , wherein the III-V semiconductor is doped.
5. The method of claim 1 , wherein the conductive film comprises gold.
6. The method of claim 1 , wherein the oxidizing agent comprises potassium permanganate (KMnO 4 ).
7. The method of claim 1 , wherein the acid is selected from the group consisting of sulfuric acid (H 2 SO 4 ) and hydrofluoric acid (H F).
8. The method of claim 1 , further comprising varying a concentration of the oxidizing agent in the etchant solution.
9. The method of claim 1 , wherein the selectively removing the portion of the III-V semiconductor takes place at a temperature of from about 40° C. to about 45° C.
10. The method of claim 1 , wherein the conductive film pattern and the semiconductor substrate are immersed in the etchant solution for about 3 to about 5 minutes.
11. The method of claim 1 , further comprising:
generating holes (h + ) from the oxidizing agent on the conductive film pattern;
diffusing the holes (h + ) to a boundary of the conductive film pattern, III-V semiconductor, and etchant solution; and
removing the holes (h + ) from semiconductor substrate substantially immediately upon the holes (h + ) reaching the boundary.
12. The method of claim 1 , further comprising forming features in the semiconductor substrate having a length-to-width aspect ratio of at least about 5:1, thereby forming an array of high aspect ratio semiconductor nanostructures.
13. The method of claim 12 , wherein the array of high aspect ratio semiconductor nanostructures is an ordered array of nanowires.
14. The method of claim 1 , wherein a concentration of the oxidizing agent in the etchant solution is in a range of from about 20 mM to about 150 mM.
15. A method of metal assisted chemical etching,
the method comprising:
providing a conductive film pattern disposed on a semiconductor substrate, the semiconductor substrate comprising a III-V semiconductor; and
selectively removing at least a portion of the III-V semiconductor immediately below the conductive film pattern by immersing the conductive film pattern and the semiconductor substrate into an etchant solution comprising an acid and an oxidizing agent selected from the group consisting of potassium permanganate (KMnO 4 ) and potassium persulfate (K 2 S 2 O 8 ).
16. The method of claim 15 , wherein the III-V semiconductor comprises gallum arsenide.
17. The method of claim 15 , wherein a concentration of the oxidizing agent in the etchant solution is in a range of from about 20 mM to about 150 mM.
18. The method of claim 15 , wherein the selectively removing the portion of the III-V semiconductor takes place at a temperature of from about 40° C. to about 45° C.