Thin film thermoelectric devices having favorable crystal tilt
View Patent ↗A method of fabricating a thermoelectric device includes providing a substrate having a plurality of inclined growth surfaces protruding from a surface thereof. Respective thermoelectric material layers are grown on the inclined growth surfaces, and the respective thermoelectric material layers coalesce to collectively define a continuous thermoelectric film. A surface of the thermoelectric film opposite the surface of the substrate may be substantially planar, and a crystallographic orientation of the thermoelectric film may be tilted at an angle of about 45 degrees or less relative to a direction along a thickness thereof. Related devices and fabrication methods are also discussed.
1. A method of fabricating a thermoelectric device, the method comprising:
providing a substrate having a plurality of inclined growth surfaces protruding from a surface thereof, wherein the inclined growth surfaces are tilted at an angle of about 45 degrees or less relative to a direction perpendicular to the surface of the substrate; and
growing respective thermoelectric material layers on the inclined growth surfaces to define separate growth sites thereon,
wherein the respective thermoelectric material layers on adjacent ones of the inclined growth surfaces coalesce to collectively define a continuous thermoelectric film.
2. The method of claim 1 , wherein a surface of the thermoelectric film opposite the surface of the substrate is substantially planar.
3. The method of claim 2 , wherein the thermoelectric film has a crystallographic orientation that is tilted at an angle of about 45 degrees or less relative to a direction along a thickness defined between the surface of the thermoelectric film opposite the surface of the substrate and an opposing surface of the thermoelectric film adjacent the surface of the substrate.
4. The method of claim 3 , wherein a plane defined by the crystallographic orientation of the thermoelectric film includes a direction of lowest resistivity in the thermoelectric film.
5. The method of claim 3 , wherein a plane defined by the crystallographic orientation of the thermoelectric film includes a lowest pK product in the thermoelectric film.
6. The method of claim 3 , wherein a plane defined by the crystallographic orientation of the thermoelectric film includes a highest ZT in the thermoelectric film.
7. The method of claim 3 , wherein the thermoelectric film has a thickness of less than about 100 micrometers.
8. The method of claim 3 , wherein the thermoelectric film has a thickness of less than about 50 micrometers.
9. The method of claim 3 , wherein the thermoelectric film has a thickness of less than about 35 micrometers.
10. The method of claim 2 , further comprising the following after epitaxially growing the respective thermoelectric material layers on the inclined growth surfaces:
removing the substrate such that a surface of the thermoelectric film opposite the substantially planar surface thereof includes a plurality of inclined features protruding therefrom.
11. The method of claim 2 , further comprising:
assembling the thermoelectric film between first and second thermally conductive headers to define a path of thermal and/or electrical conduction between the substantially planar surface and the surface opposite thereto.
12. The method of claim 2 , further comprising:
polishing the thermoelectric film to define the substantially planar surface thereof.
13. The method of claim 1 , wherein the inclined growth surfaces define triangular features and wherein the inclined growth surfaces are not perpendicular to the surface of the substrate.
14. The method of claim 1 , wherein the thermoelectric film includes a plurality of non-uniform crystallographic orientations, and wherein at least half of the plurality of orientations are tilted at respective angles of about 45 degrees or less relative to a direction along a thickness of the thermoelectric film defined between a surface of the thermoelectric film opposite the surface of the substrate and an opposing surface of the thermoelectric film adjacent the surface of the substrate.
15. The method of claim 1 , wherein the thermoelectric film includes a plurality of substantially uniform crystallographic orientations that are tilted at respective angles of about 45 degrees or less relative to a direction along a thickness of the thermoelectric film defined between a surface of the thermoelectric film opposite the surface of the substrate and an opposing surface of the thermoelectric film adjacent the surface of the substrate.
16. The method of claim 15 , wherein growing the respective thermoelectric material layers comprises selectively growing the respective thermoelectric material layers on ones of the inclined growth surfaces that are substantially parallel to one another.
17. The method of claim 16 , wherein a crystallographic orientation of the surface of the substrate defines a {100} plane, and wherein the trenches extend in a direction substantially parallel to an <010> direction.
18. The method of claim 1 , wherein adjacent ones of the inclined growth surfaces define opposing sidewalls of respective trenches in the surface of the substrate.
19. The method of claim 18 , wherein providing the substrate comprises:
etching the surface of the substrate using a dry etchant to define preliminary trenches therein; and then
etching the preliminary trenches using a wet etchant comprising an isotropic component to define the respective trenches.
20. The method of claim 1 , further comprising:
depositing an intermediate material layer on the inclined growth surfaces prior to growing the respective thermoelectric material layers thereon, wherein the intermediate material layer is different than the substrate and/or the thermoelectric material layers.
21. The method of claim 20 , wherein the intermediate material layer has a thickness of between about 10 Angstroms (Å) and about 500 Å, and/or wherein the thickness of the intermediate layer is varied to induce tilted facets.
22. The method of claim 20 , wherein the intermediate material layer comprises chromium (Cr), copper (Cu), gold (Au), iridium (Ir), iron (Fe), nickel (Ni), niobium (Nb), palladium (Pd), platinum (Pt), silver (Ag), tantalum (Ta), titanium (Ti), tungsten (W), and/or alloys thereof.
23. The method of claim 1 , wherein the inclined growth surfaces are non-orthogonal to the surface of the substrate and define triangular peaks that protrude from the surface of the substrate by about 0.1 micrometers or more.
24. The method of claim 23 , wherein a pitch between adjacent ones of the triangular peaks is about 0.1 micrometers to about 10 micrometers.
25. The method of claim 1 , wherein the thermoelectric film comprises a Group V-VI material, a Group III-V material, and/or a Group II-VI material having anisotropic thermoelectric properties.
26. The method of claim 25 , wherein the thermoelectric film is a compound comprising bismuth (Bi), antimony (Sb), lead (Pb), tellurium (Te), and/or selenium (Se).
27. The method of claim 25 , wherein the substrate comprises silicon (Si), gallium arsenide (GaAs), barium fluoride (BaF), silicon carbide (SiC), gallium nitride (GaN), aluminum nitride (AlN), sapphire, and/or glass.