Patent Assignment
Reel/Frame 041929/0621
Merger
Recorded: 2017-04-07
Pages: 9
Assignor
LAIRD DURHAM, INC.
Executed: 2016-12-31
Assignee
LAIRD TECHNOLOGIES, INC.
3481 RIDER TRAIL SOUTH, EARTH CITY, MISSOURI, 63045
Covered Properties
(24)
Thermoelectric Heating/Cooling Devices Including Resistive Heaters
PCT:
PCT/US2014/039376 ↗
Low Temperature Chemical Vapor Deposition and Etching Apparatus and Method
Patent:
6,071,351 →
Application:
09/147,199 →
Thin-Film Thermoelectric Device and Fabrication Method of Same
Patent:
6,300,150 →
Application:
09/381,963 →
Cascade Cryogenic Thermoelectric Cooler for Cryogenic and Room Temperature Applications
Thin-Film Thermoelectric Cooling and Heating Devices for Dna Genomic and Proteomic Chips, Thermo-Optical Switching Circuits, and Ir Tags
Cascade Cryogenic Thermoelectric Cooler for Cryogenic and Room Temperature Applications
Phonon-Blocking, Electron-Transmitting Low-Dimensional Structures
Cascade Cryogenic Thermoelectric Cooler for Cryogenic and Room Temperature Applications
Thin-Film Thermoelectric Device and Fabrication Method of Same
Patent:
41,801 →
Application:
10/404,144 →
Thermoelectric Devices Utilizing Double-Sided Peltier Junctions and Methods of Making the Devices
Trans-Thermoelectric Device
Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics
Thermoelectric Generators for Solar Conversion and Related Systems and Methods
Methods of Forming Thermoelectric Devices Including Conductive Posts and/or Different Solder Materials and Related Methods and Structures
Methods of Forming Thermoelectric Devices Including Electrically Insulating Matrices Between Conductive Traces
Methods of Forming Embedded Thermoelectric Coolers with Adjacent Thermally Conductive Fields
Methods of Forming Thermoelectric Devices Using Islands of Thermoelectric Material and Related Structures
Electronic Assemblies Providing Active Side Heat Pumping
Methods of Depositing Epitaxial Thermoelectric Films Having Reduced Crack and/or Surface Defect Densities and Related Devices
Thermoelectric Heat Pumps and Methods for Providing Active Thermal Barriers to Electronic Devices
Application:
12/371,006 →
Publication:
US 2009/0205696
Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics
Thermoelectric Devices Including Thermoelectric Elements Having Off-Set Metal Pads and Related Structures, Methods, and Systems
Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces
Thin Film Thermoelectric Devices Having Favorable Crystal Tilt
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 30, 2019
From: LAIRD TECHNOLOGIES, INC.
To: LAIRD THERMAL SYSTEMS, INC.
Reel/Frame 050566/0923 →
Assignment of Assignor's Interest
Sep 30, 2019
From: LAIRD TECHNOLOGIES, INC.
To: LAIRD THERMAL SYSTEMS, INC.
Reel/Frame 050567/0729 →
Change of Name
Jun 22, 2021
From: NEXTREME THERMAL SOLUTIONS, INC.
To: LAIRD DURHAM, INC.
Reel/Frame 056647/0936 →
Security Interest
Dec 27, 2021
From: LAIRD THERMAL SYSTEMS, INC.
To: LUCID TRUSTEE SERVICES LIMITED, AS SECURITY AGENT
Reel/Frame 058485/0705 →
Change of Name
May 16, 2025
From: LAIRD THERMAL SYSTEMS, INC.
To: TARK THERMAL SOLUTIONS, INC.
Reel/Frame 071298/0370 →