Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
View Patent ↗A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
1. A system for controlling temperatures on a semiconductor chip, the system comprising:
heat generating circuits on the semiconductor chip;
plural thermoelectric devices thermally coupled to the semiconductor chip and configured to extract heat from the heat generating circuits;
at least one heat sink thermally coupled to the thermoelectric devices and configured to dissipate heat from the thermoelectric devices into an environment apart from the semiconductor chip;
a thermal interface material configured to thermally couple the at least one heat sink to the semiconductor chip; and
a processor configured to operate the plural thermoelectric devices in at least one of a cooling mode, a heat pump mode, and a power conversion mode to equilibrate temperatures across the semiconductor chip,
wherein the processor comprises inputs configured to receive temperature measurements from the semiconductor chip and at least one of operating voltages, currents, and temperatures in the thermoelectric devices, and
wherein the processor comprises a mapping unit configured to produce from the temperature measurements and the at least one of operating voltages, currents, and temperatures a power dissipation map for integrated circuits on the semiconductor chip, and
wherein the processor is configured to provide the power dissipation map as feedback to control distribution of processing to the integrated circuits on the semiconductor chip.
2. The system of claim 1 , wherein the heat generating circuits comprise at least one of microprocessor circuits, communication circuits, analog-to-digital conversion circuits, bit synchronization circuits, demodulation circuits, light-emitting circuits, and power electronic circuits.
3. The system of claim 1 , further comprising:
said semiconductor chip having a surface in proximity to the heat generating device; and
said heat extraction device thermally coupled to a side of the semiconductor chip opposite said surface containing the heat generating device.
4. The system of claim 1 , further comprising:
said semiconductor chip having a surface in proximity to the heat generating device; and
said heat extraction device thermally coupled to said surface containing the heat generating device.
5. The system of claim 1 , wherein the processor comprises a neural network processor.
6. An electronic device comprising:
a semiconductor chip including a plurality of integrated circuits;
a plurality of thermoelectric devices thermally coupled to and spaced apart on the semiconductor chip; and
a processor coupled to the plurality of thermoelectric devices, wherein the processor is configured to
operate the plurality of thermoelectric devices in at least one of a cooling mode, a heat pump mode, and/or a power conversion mode to equilibrate temperatures across the semiconductor chip,
receive temperature measurements from the semiconductor chip,
receive at least one of operating voltages, currents, and/or temperatures in the plurality of thermoelectric devices,
produce from the temperature measurements and the at least one of operating voltages, currents, and temperatures in the plurality of thermoelectric devices a power dissipation map for integrated circuits on the semiconductor chip, and
provide the power dissipation map as feedback to control distribution of
processing to the integrated circuits on the semiconductor chip.