IP Library › Assignment 056657/0043
Patent Assignment
Reel/Frame 056657/0043

Assignment of Assignor's Interest

Recorded: 2021-06-24 Pages: 5
Assignor
RESEARCH TRIANGLE INSTITUTE
Executed: 2005-03-23
Assignee
NEXTREME THERMAL SOLUTIONS, INC.
3040 CORNWALLIS ROAD, P.O. BOX 13981, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709-3981
Covered Property (1)
Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics
Patent: 7,997,087 →
Application: 12/403,866 →
Publication: US 2009/0282852
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Apr 7, 2017
From: LAIRD DURHAM, INC.
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 041929/0621 →
Assignment of Assignor's Interest Sep 30, 2019
From: LAIRD TECHNOLOGIES, INC.
To: LAIRD THERMAL SYSTEMS, INC.
Reel/Frame 050567/0729 →
Change of Name Jun 22, 2021
From: NEXTREME THERMAL SOLUTIONS, INC.
To: LAIRD DURHAM, INC.
Reel/Frame 056647/0936 →
Assignment of Assignor's Interest Jun 24, 2021
From: VENKATASUBRAMANIAN, RAMA; ALLEY, RANDALL G.; ADDEPALLI, PRATIMA; REDDY, ANIL J.
To: NEXTREME THERMAL SOLUTIONS, INC.
Reel/Frame 056652/0763 →
Security Interest Dec 27, 2021
From: LAIRD THERMAL SYSTEMS, INC.
To: LUCID TRUSTEE SERVICES LIMITED, AS SECURITY AGENT
Reel/Frame 058485/0705 →