Patent Assignment
Reel/Frame 056652/0763
Assignment of Assignor's Interest
Recorded: 2021-06-24
Pages: 13
Assignors
VENKATASUBRAMANIAN, RAMA
Executed: 2005-02-28
ALLEY, RANDALL G.
Executed: 2005-02-28
ADDEPALLI, PRATIMA
Executed: 2005-02-28
REDDY, ANIL J.
Executed: 2005-02-28
SIIVOLA, EDWARD P.
Executed: 2005-02-28
O'QUINN, BROOKS C.
Executed: 2005-02-28
COONLEY, KIP D.
Executed: 2005-02-28
POSTHILL, JOHN
Executed: 2005-02-28
COLPITTS, THOMAS
Executed: 2005-02-28
Assignee
NEXTREME THERMAL SOLUTIONS, INC.
P.O. BOX 13981, 3040 CORNWALLIS ROAD, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709-3981
Covered Property
(1)
Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 30, 2019
From: LAIRD TECHNOLOGIES, INC.
To: LAIRD THERMAL SYSTEMS, INC.
Reel/Frame 050567/0729 →
Change of Name
Jun 22, 2021
From: NEXTREME THERMAL SOLUTIONS, INC.
To: LAIRD DURHAM, INC.
Reel/Frame 056647/0936 →
Assignment of Assignor's Interest
Jun 24, 2021
From: RESEARCH TRIANGLE INSTITUTE
To: NEXTREME THERMAL SOLUTIONS, INC.
Reel/Frame 056657/0043 →
Security Interest
Dec 27, 2021
From: LAIRD THERMAL SYSTEMS, INC.
To: LUCID TRUSTEE SERVICES LIMITED, AS SECURITY AGENT
Reel/Frame 058485/0705 →