Seed panel
A method of forming a plantable structure involves providing a substrate element, a release layer spaced from the substrate element, an adhesive layer disposed between the substrate element and the release layer, and at least one seed abutting the adhesive layer. The seed(s) is/are coupled to the substrate element through the adhesive layer. The method further comprises removing the release layer from the composite article, and adhering a remaining portion of the composite article to a secondary article. The remaining portion of the secondary article comprises the substrate element, the adhesive layer disposed on the substrate element, and the seed(s) abutting the adhesive layer. Also disclosed herein are a method of planting at least one seed with a composite article, a packaging structure, a method of forming a packaging structure, and a method of planting at least one seed.
1. A method of forming a plantable structure, said method comprising the steps of:
providing a composite article that comprises a substrate element, a release layer spaced from the substrate element, an adhesive layer disposed between the substrate element and the release layer, and at least one seed abutting the adhesive layer, wherein the at least one seed is coupled to the substrate element through the adhesive layer;
removing the release layer from the composite article forming a remaining portion of the composite article comprising the substrate element, the adhesive layer disposed on the substrate element, and the at least one seed abutting the adhesive layer; and
adhering the remaining portion of the composite article to a secondary article.
2. The method as set forth in claim 1 wherein said removing of the release layer from the composite article comprises peeling the release layer off the substrate element.
3. The method as set forth in claim 1 wherein the release layer is a coated paper product.
4. The method as set forth in claim 3 wherein the coated paper product comprises paper coated with at least one silicone.
5. The method as set forth in claim 1 wherein the adhesive layer is a water-based adhesive.
6. The method as set forth in claim 1 wherein the substrate element is a fiberboard, a cardboard, a cardstock, a sheet of paper, a fiber, a recycled newsprint, and combinations thereof.
7. The method as set forth in claim 1 wherein the secondary article is a cup, a box, a book mark, a business card, a carton, an envelope, a compact disc sleeve, a packaging, a bottle hand tag, or a price tag.
8. A method of planting at least one seed with a composite article, the composite article comprising a substrate element, a release layer spaced from the substrate element, an adhesive layer disposed between the substrate element and the release layer, and at least one seed abutting the adhesive layer, wherein the at least one seed is coupled to the substrate element through the adhesive layer, said method comprising the steps of:
removing the release layer from the composite article forming a remaining portion of the composite article comprising the substrate element, the adhesive layer disposed on the substrate element, and the at least one seed abutting the adhesive layer;
adhering the remaining portion of the composite article to a secondary article; and
disposing the secondary article having the remaining portion of the composite article adhered thereto in or on a growing medium to plant the at least one seed.
9. The method as set forth in claim 8 wherein said removing of the release layer is defined as peeling the release layer off of the adhesive layer.
10. The method as set forth in claim 8 further comprising applying water to the growing medium to germinate the at least one seed.
11. The method as set forth in claim 8 wherein the growing medium comprises soil or dirt.