IP Library Granted Patent US 8,809,989
Granted Patent B2
US 8,809,989 · App. 13/845,208 · Granted Aug 19, 2014

Semiconductor device

Inventor: Yoshitaka Kamo (Tokyo, JP)
Assignee: Mitsubishi Electric Corporation
H01L27/088H01L27/0605H01L27/0207H01L29/41758
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Quick Facts
Patent No.
US 8,809,989
App. No.
13/845,208
Granted
Aug 19, 2014
Kind
B2
Abstract

A semiconductor device includes: a semiconductor substrate having a hexagonal crystalline structure with a c-axis and c-planes; and transistors on a c plane of the semiconductor substrate. Source electrodes of the transistors are connected to each other. Drain electrodes of the transistors are connected to each other. Gate electrodes of the transistors are connected to each other. The gate electrodes of the transistors extend along directions that form angles with each other that are 60 degrees or 120 degrees, in a plan view seen from a direction perpendicular to the c plane of the semiconductor substrate.

Claims (25)

1. A semiconductor device comprising:

a semiconductor substrate of a material having a hexagonal crystalline structure with a c-axis and c-planes; and

a plurality of transistors on a c-plane of the semiconductor substrate, wherein

source electrodes of the plurality of transistors are connected to each other,

drain electrodes of the plurality of transistors are connected to each other,

gate electrodes of the plurality of transistors are connected to each other, and

the gate electrodes of the plurality of transistors extend along directions that form angles with each other that are 60 degrees or 120 degrees, in a plan view seen from a direction perpendicular to the c-plane of the semiconductor substrate.

2. The semiconductor device according to claim 1 , wherein

the plurality of transistors are transistor cells,

each gate electrode has a plurality of gate fingers, and

the gate fingers of the plurality of transistors extend along directions that form angles with each other that are 60 degrees or 120 degrees in the plan view.

3. A semiconductor device comprising:

a single-crystal semiconductor substrate having a hexagonal crystalline structure with a c-axis and c-planes transverse to the c-axis; and

first and second field effect transistors on the semiconductor substrate, wherein

each of the first and second transistors has a source electrode, a drain electrode, and a gate electrode on a surface of the semiconductor substrate,

the surface of the semiconductor substrate lies in a c-plane,

the source electrodes of the first and second transistors are electrically connected to each other,

the drain electrodes of the first and second transistors are electrically connected to each other,

the gate electrodes of the first and second transistors are electrically connected to each other,

the gate electrodes of the first and second transistors extend along respective first and second straight lines on the surface of the semiconductor substrate, and

the first and second straight lines form an angle with each other that is 60 degrees or 120 degrees, in a view perpendicular to the surface of the semiconductor substrate.

4. The semiconductor device according to claim 3 , wherein

each of the first and second transistors is a transistor cell,

each gate electrode has a plurality of gate fingers, and

the gate fingers of each of the first and second transistors respectively extend along the first and second straight lines that form the angle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2013
From: KAMO, YOSHITAKA
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 030463/0454 →
Priority Claims (1)
JP 2012-150414 · Jul 4, 2012 · national
Continuity (1)
Related Publication 20140008728A1 · Jan 9, 2014