Aircraft electronics cooling apparatus for an aircraft having a liquid cooling system
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronics cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling system of the aircraft. A coolant delivered by the liquid cooling system may flow through a board of the electronic device, through a heat sink on which the electronic device is arranged and/or through a housing in which the electronic device is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.
1. An aircraft electronics cooling apparatus comprising:
a liquid cooling system onboard the aircraft, including a coolant circulating therein;
an electronic device to be cooled, mounted within a housing, the housing comprising an inlet opening and an outlet opening; and
a cooling conduit operatively connecting the electronic device to the liquid cooling system,
wherein the coolant exiting the liquid cooling system flows through an interior of the housing and around the electronic device to cool the electronic device and the housing is flooded with the coolant in operation.
2. The aircraft electronics cooling apparatus of claim 1 , wherein the electronic device is sealed.
3. The aircraft electronics cooling apparatus of claim 1 , wherein the housing of the electronic device is sealed and/or isolated.
4. The aircraft electronics cooling apparatus of claim 1 , wherein the housing is connected to the liquid cooling system by means of a feed line and a return line.
5. The aircraft electronics cooling apparatus of claim 1 , wherein the coolant delivered by the liquid cooling system is a dielectric liquid or an electrically non-conductive liquid.
6. A method for cooling an electronic device mounted in a housing in an aircraft having a liquid cooling system and a cooling conduit, the method comprising:
cooling a coolant in the liquid cooling system;
delivering cold coolant from the liquid cooling system to the housing to flow through the interior of the housing and around the electronic device to cool the electronic device;
flooding the housing with the coolant; and
directing warm coolant from the housing back to the liquid cooling system.
7. The method of claim 6 , wherein delivering cold coolant further comprises:
delivering a dielectric liquid or electrically non-conductive liquid from the liquid cooling system to the housing.