Heat treatment apparatus heating substrate by irradiation with light
View Patent ↗A capacitor, a coil, a flash lamp, and a switching element such as an IGBT are connected in series. A controller outputs a pulse signal to the gate of the switching element. A waveform setter sets the waveform of the pulse signal, based on the contents of input from an input unit. With electrical charge accumulated in the capacitor, a pulse signal is output to the gate of the switching element so that the flash lamp emits light intermittently. A change in the waveform of the pulse signal applied to the switching element will change the waveform of current flowing through the flash lamp and, accordingly, the form of light emission, thereby resulting in a change in the temperature profile for a semiconductor wafer.
1. A heat treatment method of irradiating a substrate with light to heat the substrate, said heat treatment method comprising the step of:
applying a trigger voltage to a trigger electrode of said flash lamp once in synchronization with applying a single pulse to a gate of a switching element connected to a flash lamp to start light emission of said flash lamp, and thereafter, applying the next pulse to said gate while the current value of the current flowing in said flash lamp remains not less than a predetermined value, thereby, continuing light emission of said flash lamp and performing light irradiation to the substrate.
2. The heat treatment method according to claim 1 , wherein
said next pulse to applied to said gate without applying a new trigger voltage to said trigger electrode, thereby, continuing light emission of said flash lamp.
3. A heat treatment apparatus for irradiating a substrate with light to heat the substrate, said heat treatment apparatus comprising:
a holder holding a substrate;
a flash lamp emitting light to the substrate held by said holder;
a trigger electrode provided on said flash lamp;
a switching element connected in series with said flash lamp, a capacitor, and a coil;
a trigger circuit applying a trigger voltage to said trigger electrode; and
a controller configured to apply a trigger voltage to said trigger electrode from said trigger circuit once in synchronization with applying a single pulse to the gate of said switching element to start light emission of said flash lamp, thereafter, apply the next pulse to said gate while the current value of the current flowing in said flash lamp remains not less than a predetermined value, thereby, continue light emission of said flash lamp and perform light irradiation to the substrate.
4. The heat apparatus according to claim 3 , wherein
said controller is configured to apply said next pulse to said gate without applying a new trigger voltage from said trigger circuit to said trigger electrode, thereby, continue light emission of said flash lamp.