Non-peripherals processing control module having improved heat dissipating properties
The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.
1. A processing control unit comprising:
a processing system having an electrical printed circuit board;
a network interface; and
an encasement module, wherein the electrical printed circuit board is coupled to and housed within the encasement module, and wherein the encasement module comprises at least one of (i) aluminum and (ii) a metal alloy.
2. A processing control unit as recited in claim 1 , wherein the processing system further comprises a second electrical printed circuit board coupled to and housed within the encasement module.
3. A processing control unit as recited in claim 1 , wherein the network interface comprises a wireless network interface.
4. A processing control unit as recited in claim 3 , wherein the wireless network interface is capable of receiving a wireless signal.
5. A processing control unit as recited in claim 3 , wherein the wireless network interface is capable of receiving a Bluetooth signal.
6. A processing control unit as recited in claim 1 , wherein the network interface is operably coupled to a portion of the encasement module that is used to receive a signal.
7. A processing control unit comprising:
a processing system having an electrical printed circuit board;
a wireless network interface; and
an encasement module, wherein the electrical printed circuit board is coupled to and housed within the encasement module, and wherein the encasement module comprises at least one of (i) aluminum and (ii) a metal alloy.
8. A processing control unit as recited in claim 7 , wherein the processing system further comprises a second electrical printed circuit board coupled to and housed within the encasement module.
9. A processing control unit as recited in claim 7 , wherein the wireless network interface is capable of receiving a wireless signal.
10. A processing control unit as recited in claim 7 , wherein the wireless network interface is capable of receiving a Bluetooth signal.
11. A processing control unit as recited in claim 7 , wherein the wireless network interface is operably coupled to a portion of the encasement module that is capable of receiving a signal.