Wireless communication module, LED lighting device, solar photovoltaic system, self-start system and detection device

1. A wireless communication module comprising:

a wireless circuit configured to transmit/receive a wireless signal;

a first inter-board connector;

a first board on which the wireless circuit and the first connector are mounted;

a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit;

a second inter-board connector configured to be connected to the first connector; and

a second board on which the signal processing circuit and the second connector are mounted,

wherein the first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected, and

wherein the first board and the second board are arranged such that a board side of the first board on which the wireless circuit is mounted faces a board side of the second board on which the signal processing circuit is not mounted.

2. The wireless communication module of claim 1 , wherein an antenna is disposed in a region on the first board where the first board and the second board do not overlap with each other.

3. A wireless communication module comprising:

a wireless circuit configured to transmit/receive a wireless signal;

a first inter-board connector;

a first board on which the wireless circuit and the first connector are mounted;

a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit;

a second inter-board connector configured to be connected to the first connector; and

a second board on which the signal processing circuit and the second connector are mounted,

wherein the first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected, and

wherein the wireless circuit is covered by a metal shield plate.

4. The wireless communication module of claim 3 , wherein a projection is formed at a predetermined position of a top of the shield plate which faces the second board.

5. The wireless communication module of claim 4 , wherein a signal wiring pattern is formed in a region avoiding the projection on the board side of the second board which faces the first board.

6. The wireless communication module of claim 4 , wherein a ground wiring pattern is formed in a region contacting the projection on the board side of the second board which faces the first board.

7. The wireless communication module of claim 4 , wherein the projection is an elastically deformable spring, and the projection contacts the second board, with the projection being bent, when the first connector and the second connector are interconnected.

8. A wireless communication module comprising:

a wireless circuit configured to transmit/receive a wireless signal;

a first inter-board connector;

a first board on which the wireless circuit and the first connector are mounted;

a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit;

a second inter-board connector configured to be connected to the first connector; and

a second board on which the signal processing circuit and the second connector are mounted,

wherein the first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected, and

wherein the first board has a higher dielectric constant than that of the second board.

9. A wireless communication module comprising:

a wireless circuit configured to transmit/receive a wireless signal;

a first inter-board connector;

a first board on which the wireless circuit and the first connector are mounted;

a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit;

a second inter-board connector configured to be connected to the first connector; and

a second board on which the signal processing circuit and the second connector are mounted,

wherein the first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected, and

wherein a fourth connector taller than a distance between the first board and the second board is disposed in a region on the second board where the first board and the second board do not overlap with each other.

10. The wireless communication module of claim 9 , wherein the fourth connector has eight pins including a VDD pin, a TXD pin, a RXD pin, a RTS pin, a CTS pin, a GPIO pin, another GPIO pin and a GND pin, arranged in this order.

11. The wireless communication module of claim 10 , wherein the eight pins are arranged on the same plane in parallel to a board side of the second board.

12. The wireless communication module of claim 9 , wherein the wireless circuit is covered by a metal shield plate, and projections are respectively formed in four corners of a top of the shield plate which faces the second board and a central portion of one edge of a quadrangle defined by the four corners.

13. The wireless communication module of claim 12 , wherein an antenna is disposed in a region on the first board where the first board and the second board do not overlap with each other, and the shield plate is disposed at a distance from the antenna, the distance being larger than ¼ of a wavelength of a radio wave transmitted/received by the antenna.

14. A solar photovoltaic system comprising a wireless communication module of claim 1 .