IP Library Granted Patent US 9,027,226
Granted Patent B2
US 9,027,226 · App. 13/851,804 · Granted May 12, 2015

Method for implementing prompt dose mitigating capacitor

Inventors: Murty S. Polavarapu (Vienna, VA); Nadim F. Haddad (Oakton, VA)
Assignee: BAE Systems Information and Electronic Systems Integration Inc.
H01G2/065Y10T29/49002H01G4/33H01L24/01
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,027,226
App. No.
13/851,804
Granted
May 12, 2015
Kind
B2
Abstract

A method for implementing a prompt dose mitigating capacitor is disclosed. Initially, a flip chip is provided with multiple capacitors. The flip chip is then placed on top of a substrate having multiple electronic devices connected to a set of power rails. The terminals of the capacitors within the flip chip are subsequently connected to the power rails within the substrate in order to regulate voltages appeared on the power rails during a radiation pulse.

Claims (7)

1. A method for mitigating prompt dose upset and prompt dose transients, said method comprising:

providing a flip chip having a plurality of capacitors;

placing said flip chip on top of an electronic device's substrate on which a plurality of electronic components were built, wherein said plurality of electronic components are connected to a set of power rails within said substrate of said electronic device; and

connecting terminals of said plurality of capacitors within said flip chip only to said power rails within said substrate of said electronic device to form a prompt dose mitigating capacitor configured to supply an amount of charges in order to regulate voltages on said power rails within said substrate of said electronic device after an occurrence of a radiation pulse.

2. The method claim 1 , wherein said connecting further includes connecting terminals of said plurality of capacitors within said flip chip only to said power rails within said substrate via a ball grid array.

3. The method of claim 1 , wherein said capacitors are MIMCAPs.

4. The method of claim 1 , wherein said capacitors are trench capacitors.

Assignments (3)
CONFIRMATORY LICENSE Recorded Nov 21, 2013
From: BAE SYSTEMS
To: DEFENSE THREAT REDUCTION AGENCY; DEPT. OF DEFENSE; UNITED STATES GOVERNMENT
Reel/Frame 031693/0748 →
CONFIRMATORY LICENSE Recorded Jun 12, 2013
From: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
To: DEFENSE THREAT REDUCTION AGENCY; DEPT. OF DEFENSE; UNITED STATES GOVERNMENT
Reel/Frame 030602/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2013
From: POLAVARAPU, MURTY S.; HADDAD, NADIM F.
To: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
Reel/Frame 030099/0459 →
Continuity (1)
Related Publication 20140290038A1 · Oct 2, 2014