Forming in-situ micro-feature structures with coreless packages
View Patent ↗Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure.
1. A structure comprising:
a die disposed in a package structure;
a dielectric material adjacent the die;
die pad interconnect structures in the die area; and
at least one micro-feature structure disposed on a top portion of the die, wherein the at least one micro-feature structure is disposed directly on an etch stop material disposed directly on the die.
2. The structure of claim 1 wherein the at least one micro-feature structure comprises a copper material.
3. The structure of claim 1 wherein the package structure comprises a portion of a coreless bumpless buildup package structure.
4. The structure of claim 1 wherein the at least one micro-feature structure comprises a heat spreader.
5. The structure of claim 2 wherein the die is partially embedded into the coreless substrate, and wherein the dielectric material is formed along a portion of a sidewall of the die and not on a top portion of the die.
6. The structure of claim 5 wherein the etch stop material comprises nickel.
7. The structure of claim 3 wherein the package structure further comprises at least one of a PoP land structure and an inductor structure on a top surface of the package structure, wherein the at least one micro-channel structure and the at least one PoP land structure and inductor structure comprise the same material.