Printed waveguide transmission line having layers with through-holes having alternating greater/lesser widths in adjacent layers

1. A multi-layer apparatus comprising:

a first conducting layer including an input port, wherein the input port is configured to transmit millimeter electromagnetic waves;

a second conducting layer including at least one through-hole;

a first layer between the first conducting layer and the second conducting layer, wherein the first layer includes a first waveguide including a through-hole of greater width than the at least one through hole of the second conducting layer, and wherein the through-hole of the first waveguide is aligned at least in part with the input port and the at least one through-hole of the second conducting layer;

a third conducting layer including an output port, wherein the output port is configured to receive millimeter electromagnetic waves; and

a second layer between the second conducting layer and the third conducting layer, wherein the second layer includes a second waveguide including a through-hole of greater width than the at least one through hole of the second conducting layer, wherein the through-hole of the second waveguide is aligned at least in part with the output port and the at least one through-hole of the second conducting layer, and wherein the at least one through-hole of the second conducting layer is configured to couple millimeter electromagnetic waves from the first waveguide to the second waveguide.

2. The apparatus of claim 1 , further comprising a respective adhesive layer between one or more of:

the first conducting layer and the first layer,

the first layer and the second conducting layer,

the second conducting layer and the second layer, and

the second layer and the third conducting layer.

3. The apparatus of claim 1 , wherein the first layer and the second layer comprise a dielectric material, and wherein a metallic material is deposited on respective inner surfaces of the at least one through-hole of the second conducting layer, and of the first waveguide and the second waveguide.

4. The apparatus of claim 1 , wherein the first layer and the second layer includes a metallic material.

5. The apparatus of claim 1 , wherein the first layer and the second layer includes a printed circuit board (PCB).

6. The apparatus of claim 1 , wherein the first waveguide comprises:

a first waveguide channel;

a second waveguide channel coupled to the first waveguide channel;

a third waveguide channel coupled to the second waveguide channel;

a fourth waveguide channel coupled to the third waveguide channel; and

a fifth waveguide channel coupled to the fourth waveguide channel.

7. The apparatus of claim 1 , wherein the input port and the output port include WR-10 flanges.

8. The apparatus of claim 1 , wherein the first waveguide comprises:

a first waveguide channel;

a second waveguide channel substantially parallel to the first waveguide channel; and

at least one hole for coupling the first waveguide channel to the second waveguide channel.

9. The apparatus of claim 1 , wherein the first waveguide comprises:

a first waveguide channel;

a second waveguide channel substantially perpendicular to the first waveguide channel; and

at least one hole for coupling the first waveguide channel to the second waveguide channel.

10. A method comprising:

forming a first layer comprising a first dielectric layer coupled between a first conducting layer and a second conducting layer, wherein the first layer includes an input port configured to transmit millimeter electromagnetic waves;

forming a second layer coupled to the first layer and comprising a second dielectric layer coupled between a third conducting layer and a fourth conducting layer, wherein the second layer includes a first waveguide including a through-hole that is aligned at least in part with the input port;

forming a third layer coupled to the second layer and comprising a third dielectric layer coupled between a fifth conducting layer and a sixth conducting layer, wherein the third layer includes at least one through-hole that is aligned at least in part with the through-hole of the first waveguide, and wherein the through-hole of the first waveguide has a greater width than the at least one through hole of the third layer;

forming a fourth layer coupled to the third layer and comprising a fourth dielectric layer coupled between a seventh conducting layer and an eighth conducting layer, wherein the fourth layer includes a second waveguide including a through-hole of greater width than the at least one through hole of the third layer, and wherein the through-hole of the second waveguide is aligned at least in part with the at least one through-hole of the third layer; and

forming a fifth layer coupled to the fourth layer and comprising a fifth dielectric layer coupled between a ninth conducting layer and a tenth conducting layer, wherein the fifth layer includes an output port configured to receive millimeter electromagnetic waves that is aligned at least in part with the second waveguide, and wherein the at least one through-hole of the third layer is configured to couple millimeter electromagnetic waves from the through-hole of the first waveguide to the through-hole of the second waveguide.

11. The method of claim 10 , further comprising:

providing a respective adhesive layer between one or more of:

the first layer and the second layer,

the second layer and the third layer,

the third layer and the fourth layer, and

the fourth layer and the fifth layer.

12. The method of claim 10 , the method further comprising:

providing a conductive material plating on respective inner surfaces of the at least one through-hole of the third layer, and of the first waveguide and the second waveguide.

13. A method comprising:

forming a first conducting layer including an input port, wherein the input port is configured to transmit millimeter electromagnetic waves;

forming a second conducting layer including at least one through-hole;

forming a first layer between the first conducting layer and the second conducting layer, wherein the first layer includes a first waveguide including a through-hole of greater width than the at least one through hole of the second conducting layer, and wherein the through-hole of the first waveguide is aligned at least in part with the input port and the at least one through-hole of the second conducting layer;

forming a third conducting layer including an output port, wherein the output port is configured to receive millimeter electromagnetic waves; and

forming a second layer between the second conducting layer and the third conducting layer, wherein the second layer includes a second waveguide including a through-hole of greater width than the at least one through hole of the second conducting layer, wherein the through-hole of the second waveguide is aligned at least in part with the output port and the at least one through-hole of the second conducting layer, and wherein the at least one through-hole of the second conducting layer is configured to couple millimeter electromagnetic waves from the first waveguide to the second waveguide.

14. The method of claim 13 , wherein the first layer and the second layer comprise a respective dielectric material, the method further comprising:

providing a conductive material plating on respective inner surfaces of the at least one through-hole of the second conducting layer, and of the first waveguide and the second waveguide.

15. The method of claim 13 , wherein the first layer and the second layer includes a metallic material.

16. The method of claim 13 , wherein the first layer and the second layer includes a printed circuit board (PCB).

17. The method of claim 13 , further comprising:

providing a respective adhesive layer between one or more of:

the first conducting layer and the first layer,

the first layer and the second conducting layer,

the second conducting layer and the second layer, and

the second layer and the third conducting layer.