Low power, high density server and portable device for use with same
A high density server including a plurality of portable devices is disclosed. The portable devices may be arranged in drawers, which may be assembled into shelves for mounting within the high density server. The server rack of the high density server has a substantially open bottom and open top to permit passive airflow in and around the portable devices housed therein. Because of the configuration of the portable devices within the server, the computing power density is increased over a traditional server. Also, the design of the portable devices and their placement within the high density server minimizes the need for active cooling and in some embodiments removes the need for active cooling mechanisms altogether. The portable devices are encased in a protective coating that facilitates heat dissipation away from the portable device. The portable devices include components found in traditional servers.
1. A high density server module comprising:
a server rack having a plurality of shelf openings;
a plurality of shelves each slidably engaged with a corresponding one of said plurality of shelf openings; and
a plurality of portable servers, wherein multiple ones of said plurality of portable servers are removably disposed within each of said plurality of shelves;
a plurality of drawers slidably engaged with ones of said plurality of shelves and configured to accept at least two of said plurality of portable servers; and
wherein said plurality of portable servers and said plurality of shelves, when installed in said server rack, form a stacked open architecture that allows for air flow in and around said plurality of portable servers, and
wherein said stacked open architecture lacks a horizontal structure within said server rack that substantially impedes airflow between the bottom and the top of said server rack.
2. A high density server according to claim 1 , wherein said plurality of drawers include a backplane, said backplane having a plurality of slots for receiving ones of said plurality of portable servers.
3. A high density server according to claim 1 , wherein each of said plurality of portable servers includes: at least one printed circuit board having at least one integrated circuit; and a coating substantially covering said at least one integrated circuit.
4. A high density server according to claim 1 , where each of said plurality of portable servers includes a storage component that is a solid-state drive.
5. A high density server according to claim 1 , wherein the high density server does not include an air movement device within said server rack.
6. A high density server according to claim 1 , wherein each of said plurality of portable servers is about 4 mm in height, about 83 mm in length, and about 52 mm in width.
7. A high density server according to claim 1 , wherein more than about 50 of said plurality of portable servers are removably coupleable to each of said plurality of drawers.
8. A high density server according to claim 1 , wherein more than about 250 of said plurality of portable servers are disposed on each of said plurality of shelves.
9. A high density server according to claim 1 , wherein up to about 6000 of said plurality of portable servers is included within said server rack.
10. A high density server according to claim 2 , wherein each of said plurality of shelves includes a motherboard and wherein said backplane is a multilayered data and power transmission device that provides for data transmission to and from individual ones of said plurality of portable servers and to and from said motherboard.
11. A high density server according to claim 2 , wherein each of said plurality of drawers is operated independently of other ones of said plurality of drawers.
12. A high density server according to claim 3 , wherein said coating is a single coating that inhibits tampering with, dissipates heat from, and waterproofs said at least one integrated circuit.
13. A high density server according to claim 12 , wherein said single coating is selected from the group consisting of silicone, epoxy, acrylic, urethane, and paraxylene.