High speed, high density, low power die interconnect system
A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.
1. A die comprising:
a conducting layer;
a plurality of interposed conducting layers separated by a plurality of interposed dielectric layers, wherein the plurality of interposed conducting layers and the plurality of interposed dielectric layers are interposed between the conducting layer and a top surface of the die; and
a tapered contact pad electrically connected by an electrical connection to the conducting layer and extending to an outer edge of the die, wherein the electrical connection between the conducting layer and the tapered contact pad does not traverse all of the plurality of interposed conducting layers and all of the plurality of interposed dielectric layers.
2. The die of claim 1 , wherein the tapered contact pad comprises a stepped via.
3. The die of claim 2 , wherein the stepped via is formed from a plurality of stepped via conducting layer portions and a plurality of stepped via dielectric layer portions.
4. A die comprising:
an active surface;
a back surface opposite the active surface;
outer side surfaces connecting the active and back surfaces;
a conducting layer;
a plurality of interposed conducting layers and a plurality of interposed dielectric layers interposed between the conducting layer and the active surface; and
a contact pad electrically connected by an electrical connection to the conducting layer, wherein the contact pad extends to at least one of the outer side surfaces, wherein the electrical connection between the conducting layer and the contact pad does not traverse all of the plurality of interposed conducting layers and all of the plurality of interposed dielectric layers.
5. The die of claim 4 , wherein the contact pad comprises a tapered contact pad.
6. The die of claim 5 , wherein the tapered contact pad comprises a stepped via.
7. The die of claim 6 , wherein the stepped via is formed from a plurality of stepped via conducting layer portions and a plurality of stepped via dielectric layer portions.
8. The die of claim 4 , wherein the contact pad comprises an input/output (“I/O”) pad.
9. The die of claim 4 , wherein the contact pad extends along one of the outer side surfaces of the die, and wherein the one outer side surface is perpendicular to the active surface.