Resist pattern-forming method, and radiation-sensitive resin composition
A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed with a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a base polymer, a fluorine-atom-containing polymer, a radiation-sensitive acid generator, a solvent, and a compound. The base polymer has an acid-labile group. The fluorine-atom-containing polymer has a content of fluorine atoms higher than a content of fluorine atoms of the base polymer. The compound has a relative permittivity greater than a relative permittivity of the solvent by at least 15. A content of the compound is no less than 10 parts by mass and no greater than 200 parts by mass with respect to 100 parts by mass of the base polymer.
1. A resist pattern-forming method comprising:
coating a radiation-sensitive resin composition on a substrate to provide a resist film;
exposing the resist film; and
developing the exposed resist film with a developer solution comprising no less than 80% by mass of an organic solvent,
the radiation-sensitive resin composition comprising:
a base polymer having an acid-labile group;
a fluorine-atom-containing polymer having a content of fluorine atoms higher than a content of fluorine atoms of the base polymer;
a radiation-sensitive acid generator;
a solvent; and
a compound having a relative permittivity greater than a relative permittivity of the solvent by at least 15,
a content of the compound being no less than 10 parts by mass and no greater than 200 parts by mass with respect to 100 parts by mass of the base polymer, and
the base polymer having a structural unit represented by a formula (I):
wherein, in the formula (I), R 1 represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; and R p represents an acid-labile group.
2. The resist pattern-forming method according to claim 1 , wherein the compound has a relative permittivity of no less than 20 and no greater than 75.
3. The resist pattern-forming method according to claim 1 , wherein the compound has a boiling point of no less than 180° C. and no greater than 300° C. at 1 atm.
4. The resist pattern-forming method according to claim 1 , wherein the compound is a lactone compound, a cyclic carbonate compound, or a combination thereof.
5. The resist pattern-forming method according to claim 1 , wherein the acid-labile group of the base polymer comprises a monocyclic or polycyclic alicyclic hydrocarbon group.