IP Library Granted Patent US 8,828,837
Granted Patent B2
US 8,828,837 · App. 13/866,898 · Granted Sep 9, 2014

Metal-insulator-metal (MIM) device and method of formation thereof

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Quick Facts
Patent No.
US 8,828,837
App. No.
13/866,898
Granted
Sep 9, 2014
Kind
B2
Abstract

In a method of fabricating a metal-insulator-metal (MIM) device, initially, a first electrode is provided. An oxide layer is provided on the first electrode, and a protective layer is provided on the oxide layer. An opening through the protective layer is provided to expose a portion of the oxide layer, and a portion of the first electrode underlying the exposed portion of the oxide layer is oxidized. A second electrode is provided in contact with the exposed portion of the oxide layer. In alternative embodiments, the initially provided oxide layer may be eliminated, and spacers of insulating material may be provided in the opening.

Claims (11)

1. A method of fabricating a metal-insulator-metal (MIM) device comprising:

providing a first electrode;

providing a protective layer on the first electrode;

providing an opening through the protective layer to expose a portion of the first electrode;

oxidizing the exposed portion of the first electrode wherein the oxidized portion extends into the body of first electrode and has a top surface that is coplanar with the top surface of the first electrode;

providing an oxidizable layer on and contacting the oxidized portion of the first electrode and on the protective layer;

oxidizing the oxidizable layer; and

providing a second electrode in contact with the oxidized layer.

2. The method of claim 1 wherein the second electrode extends above the protective layer.

3. The method of claim 1 and further comprising said device incorporated in a system.

4. The method of claim 3 wherein the system is selected from the group consisting of a hand-held device, a vehicle, and a computer.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 044094/0669 →
RELEASE OF SECURITY INTEREST Recorded Sep 28, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 044052/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 044051/0244 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2017
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 044016/0532 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2014
From: AVANZINO, STEVEN; FANG, TZU-NING; KAZA, SWAROOP; LIAO, DONGXIANG; LO, WAI; MARRIAN, CHRISTIE; HADDAD, SAMEER
To: SPANSION LLC
Reel/Frame 034094/0925 →