Semiconductor circuit pattern measuring apparatus and method
View Patent ↗Included is a multiple resolution image generating unit which applies a plurality of noise removing filters to a semiconductor circuit pattern image and generates a multiple resolution image, a multiple resolution differential image generating unit which generates a multiple resolution differential image from a difference of images between hierarchies of the multiple resolution image, and a contour extracting unit which extracts a contour of the semiconductor circuit pattern based on an intensity signal of the semiconductor circuit pattern image. The contour extracting unit calculates an intensity signal level upon extracting a contour of the semiconductor circuit pattern from the multiple resolution image by using an image signal of the multiple resolution differential image, and extracts a contour of the semiconductor circuit pattern based on the calculated intensity signal level.
1. A semiconductor circuit pattern measuring apparatus comprising:
a receiver which receives a semiconductor circuit pattern image transmitted from a photographic device;
a multiple resolution image generating unit which applies a plurality of noise removing filters to the semiconductor circuit pattern image received by the receiver to generate a multiple different resolution images;
a multiple resolution differential image generating unit which generates a multiple resolution differential image from a difference of images between hierarchies of the multiple different resolution images; and
a contour extracting unit which extracts a contour of a semiconductor circuit pattern based on an intensity signal of the semiconductor circuit pattern image,
wherein the contour extracting unit calculates the intensity signal of the semiconductor circuit pattern image using an intensity signal of the multiple resolution differential image,
wherein the contour extracting unit calculates a top peak in which the intensity signal of the multiple resolution differential image is maximized or a bottom peak in which the intensity signal of the multiple resolution differential image is minimized, and
wherein the contour extracting unit calculates an inflection point near the top peak or the bottom peak as a middle point, normalizes the intensity signal of the multiple resolution differential image according to the top peak or the bottom peak and the middle point, and extracts the contour of the semiconductor circuit pattern at a position coordinate value corresponding to a specified intensity signal level from the normalized intensity signal.
2. The semiconductor circuit pattern measuring apparatus according to claim 1 ,
wherein the contour extracting unit calculates the position coordinate value of the top peak or the bottom peak with sub-pixel accuracy.
3. The semiconductor circuit pattern measuring apparatus according to claim 1 ,
wherein the contour extracting unit calculates the position coordinate value of the middle point with sub-pixel accuracy.
4. The semiconductor circuit pattern measuring apparatus according to claim 1 ,
wherein the contour extracting unit corrects the extracted contour through an energy optimization process.
5. The semiconductor circuit pattern measuring apparatus according to claim 4 ,
wherein the contour extracting unit corrects the extracted contour by using a graph cut method.
6. A method for use in a semiconductor circuit pattern measuring apparatus, comprising the steps of:
receiving a semiconductor circuit pattern image transmitted from a photographic device;
applying a plurality of noise removing filters to the received semiconductor circuit pattern image to generate a multiple different resolution images;
generating a multiple resolution differential image from a difference of images between hierarchies of the multiple resolution images; and
extracting a contour of a semiconductor circuit pattern based on an intensity signal of the semiconductor circuit pattern image,
wherein the semiconductor circuit pattern measuring apparatus calculates the intensity signal of the semiconductor circuit pattern image using an intensity signal of the multiple resolution differential image,
wherein the extracting the contour of the semiconductor circuit pattern includes:
calculating at least one of a top peak in which the intensity signal of the multiple resolution differential image is maximized and a bottom peak in which the intensity signal of the multiple resolution differential image is minimized,
calculating an inflection point near at least one of the top peak or the bottom peak as a middle point, and
normalizing the intensity signal of the multiple resolution differential image according to the at least one of the top peak and the bottom peak and the middle point,
wherein the contour of the semiconductor circuit pattern is extracted at a position coordinate value corresponding to a specified intensity signal level from the normalized intensity signal.
7. A semiconductor circuit pattern measuring apparatus comprising:
a receiver which receives a semiconductor circuit pattern image transmitted from a photographic device;
a processor and a memory storing instructions that, when executed by the processor, cause the processor to implement:
a multiple resolution image generating unit which applies a plurality of noise removing filters to the semiconductor circuit pattern image received by the receiver to generate multiple different resolution images;
a multiple resolution differential image generating unit which generates a multiple resolution differential image from a difference of images between hierarchies of the multiple different resolution images; and
a contour extracting unit which extracts a contour of a semiconductor circuit pattern based on an intensity signal of the semiconductor circuit pattern image,
wherein the contour extracting unit calculates the intensity signal of the semiconductor circuit pattern image using an intensity signal of the multiple resolution differential image,
wherein the contour extracting unit calculates at least one of a top peak in which the intensity signal of the multiple resolution differential image is maximized and a bottom peak in which the intensity signal of the multiple resolution differential image is minimized, and
wherein the contour extracting unit calculates an inflection point near the at least one of the top peak and the bottom peak as a middle point, normalizes the intensity signal of the multiple resolution differential image according to the at least one of the top peak and the bottom peak and the middle point, and extracts the contour of the semiconductor circuit pattern at a position coordinate value corresponding to a specified intensity signal level from the normalized intensity signal.
8. The semiconductor circuit pattern measuring apparatus according to claim 7 ,
wherein the contour extracting unit calculates the position coordinate value of the top peak or the bottom peak with sub-pixel accuracy.
9. The semiconductor circuit pattern measuring apparatus according to claim 7 ,
wherein the contour extracting unit calculates the position coordinate value of the middle point with sub-pixel accuracy.
10. The semiconductor circuit pattern measuring apparatus according to claim 7 ,
wherein the contour extracting unit corrects the extracted contour through an energy optimization process.
11. The semiconductor circuit pattern measuring apparatus according to claim 10 ,
wherein the contour extracting unit corrects the extracted contour by using a graph cut method.