Method of manufacturing lead frame
A method of manufacturing a lead frame includes, firstly, forming a metal plate which has a frame portion, a pad portion for mounting semiconductor elements, and lead portions. After that, the lead portions are etched to form a support end, a connecting terminal and a jointing end of each lead portion. Then a receiving portion for receiving the semiconductor elements is formed, wherein the receiving portion is collectively defined by the connecting terminals, the support ends and the pad portion. After that, step portions are formed on the lead portions and the pad portion by half-etching. A method of manufacturing a semiconductor package which includes the lead frame is also provided.
1. A method of manufacturing a lead frame, comprising:
forming a metal plate to have a structure comprising a frame portion, a pad portion at a center of the frame portion for mounting semiconductor elements, and a plurality of lead portions peripherally extending from the frame portion towards the pad portions;
etching each of the plurality of lead portions to form a support end, a connecting terminal and a jointing end jointing the frame portion with the connecting terminal, the connecting terminal positioned between the jointing end and the support end;
forming a receiving portion for receiving the semiconductor elements, the receiving portion collectively defined by the connecting terminals, the support ends and the pad portion; and
forming a plurality of step portions on the lead portions and the pad portion by half-etching;
wherein the lead frame comprises a plurality of support bars connecting the pad portion to corners of the frame portion, and one side of the frame portion, one side of the pad portion and one side of the plurality of support bars collectively form a first surface; and
wherein the support end of each lead portion, the jointing end of each lead portion and the frame portion are configured on the first surface, the connecting terminal of each lead portion has a top surface protruding from the first surface, and the connecting terminals of the plurality of lead portions surround the pad portion.
2. The method of claim 1 , wherein the plurality of lead portions are etched to space with each other with a first gap and to space with the pad portion with a second gap.