Monolayer or multilayer forming composition
There is provided a composition for forming a monolayer or a multilayer on the substrate. A composition for forming a monolayer or a multilayer containing a silane compound of Formula (1A) or Formula (1B): [where R 1 s are independently a methyl group or an ethyl group; Xs are independently a C 1-10 linking group; and Zs are independently a C 1-10 alkyl group or a phenyl group optionally having a substituent, where X optionally contains at least one oxygen atom or sulfur atom in the main chain thereof, and when Z is an alkyl group, at least one hydrogen atom of the alkyl group is optionally substituted with a fluorine atom] and an organic solvent.
1. A composition for forming a monolayer or a multilayer, the composition comprising:
a silane compound of Formula (1A) of Formula (1B):
[where R 1 s are independently a methyl group or an ethyl group; Xs are independently a C 1-10 linking group; and Zs are independently a C 1-10 alkyl group or a phenyl group optionally having a substituent, where X contains at least one sulfur atom in the main chain thereof, and when Z is an alkyl group, at least one hydrogen atom of the alkyl group is optionally substituted with a fluorine atom];
water;
an organic acid; and
an organic solvent, wherein the water and the organic acid are provided in the amount sufficient to enhance the preservation stability of the composition and accelerate a condensation reaction of the silane compound when the composition is applied onto a substrate and is baked to form a monolayer or multilayer.
2. The composition for forming a monolayer or a multilayer according to claim 1 , further comprising a silane compound of Formula (2):
(R 2 O) 3 Si—Y (2)
[where R 2 s are independently a methyl group or an ethyl group; and Y is a C 1-5 alkyl group optionally having a substituent or a phenyl group optionally having a substituent].
3. A method for forming a photoresist pattern, the method comprising:
a process of forming a monolayer or a multilayer on a semiconductor substrate using a composition comprising:
a silane compound of Formula (1A) or Formula (1B):
[where R 1 s are independently a methyl group or an ethyl group; Xs are independently a C 1-10 linking group; and Zs are independently a C 1-10 alkyl group or a phenyl group optionally having a substituent, where X optionally contains at least one oxygen atom or sulfur atom in the main chain thereof, and when Z is an alkyl group, at least one hydrogen atom of the alkyl group is optionally substituted with a fluorine atom]; and
an organic solvent;
a process of forming a photoresist film on the monolayer or the multilayer;
a process of exposing the semiconductor substrate coated with the monolayer or the multilayer and the photoresist film to light; and
a process of developing the photoresist film after the exposure.
4. The method for forming a photoresist pattern according to claim 3 , wherein a level difference is formed on a surface of the semiconductor substrate.
5. The method for forming a photoresist pattern according to claim 3 , wherein the composition further comprises water and an organic acid.
6. The method for forming a photoresist pattern according to claim 5 , wherein the composition further comprises a silane compound of Formula (2):
(R 2 O) 3 Si—Y (2)
[where R 2 s are independently a methyl group or an ethyl group; and Y is a C 1-5 alkyl group optionally having a substituent or a phenyl group optionally having a substituent].
7. The method for forming a photoresist pattern according to claim 3 , wherein the composition further comprises a silane compound of Formula (2):
(R 2 O) 3 Si—Y (2)
[where R 2 s are independently a methyl group or an ethyl group; and Y is a C 1-5 alkyl group optionally having a substituent or a phenyl group optionally having a substituent].