Printed circuit board, and board block for vehicles using the same

1. A printed circuit board comprising:

a first area having an insulation layer formed on a surface of a metal layer formed of a metal and a first circuit pattern formed in the insulation layer;

a second area provided separately from the first area and having a separate insulation layer formed on a surface of the metal layer and a second circuit pattern formed in the separate insulation layer; and

an exposure area formed between the first area and the second area and from which the metal layer is exposed,

wherein an input connector terminal constituting an input connector unit for supplying electric power to the metal layer is provided in any one of the first area and the second area,

wherein a component coupling terminal to which electric power is supplied through the metal layer and the first circuit pattern is provided in the first area, and a first connector terminal of a first connector unit electrically connected to the component coupling terminal is provided on a surface of the first area opposite to the surface on which the component coupling terminal is provided, and wherein a microchip to which electric power is supplied through the metal layer and the second circuit pattern is provided in the second area and a second connector terminal of a second connector unit electrically connected to the microchip.

2. The printed circuit board as claimed in claim 1 , wherein the first connector terminal, the input connector terminal, and the second connector terminal are located on the surfaces of the first area and the second area which can be viewed by each other.

3. The printed circuit board as claimed in claim 1 , wherein the exposure area is bent at a predetermined angle such that the first area and the second area are connected to each other at a predetermined angle.

4. The printed circuit board as claimed in claim 3 , wherein a fuse is coupled to the component coupling terminal of the first area, and a microchip is mounted to the second area to generate a control signal.

5. A printed circuit board comprising:

a metal layer formed of a metal; and

an insulation layer and a circuit pattern layer formed on a surface of the metal layer,

wherein the insulation layer and the circuit pattern layer are divided into a first area and a second area with respect to an exposure area from which the metal layer is exposed, wherein a component coupling terminal for coupling a fuse is installed on one surface of the first area, a first connector terminal constituting a first connector unit is installed on an opposite surface of the first area, and a first circuit pattern for supplying electric power transferred through the metal layer to the first connector terminal via the fuse is provided, and wherein a microchip is mounted to one surface of the second area to control electric power transferred through the metal layer, and a second circuit pattern for supplying a control signal output from the microchip to a second connector terminal provided in the second area is provided.

6. The printed circuit board as claimed in claim 5 , wherein electric power is supplied from the fuse to the microchip through the metal layer, and external electric power is supplied to the metal layer through an input connector unit.

7. The printed circuit board as claimed in claim 5 , wherein the exposure area is bent at a predetermined angle such that the first area and the second area are connected to each other at a predetermined angle.

8. The printed circuit board as claimed in claim 7 , wherein the input connector unit is disposed parallel to the first connector unit or the second connector unit installed in the first area or the second area.

9. A printed circuit board having a metal layer formed of a metal material, insulation layers formed on opposite surfaces of the metal layer, and circuit patterns formed on the insulation layers, the printed circuit board comprising:

an exposure area from which opposite peripheries of the metal layer and a surface between the peripheries are exposed to the outside;

a first area connected to one side of the exposure area via the metal layer, the insulation layers and the circuit patterns being formed on the opposite surfaces of the metal layer; and

a second area connected to an opposite side of the exposure area via the metal layer, the insulation layers and the circuit patterns being formed on the opposite surfaces of the metal layer,

wherein the metal layer of the exposure area is bent such that imaginary extension planes of the first area and the second area form a predetermined angle.

10. The printed circuit board as claimed in claim 9 , wherein a separate exposure area is formed along a section of at least one of the first area and the second area, and another area is provided to have a predetermined angle with the imaginary extension planes of the first and second areas.

11. The printed circuit board as claimed in claim 10 , wherein a portion of the exposure area connecting the opposite peripheries of the metal layer is linear.

12. The printed circuit board as claimed in claim 9 , wherein through portions are formed at portions of the metal layer corresponding to the first and second areas to form the insulation layers, a through hole passes through the insulation layers provided in the through portions, and the circuit patterns formed on the opposite surfaces of the insulation layers are electrically connected to each other by a plating layer formed on an inner surface of the through-hole.

13. The printed circuit board as claimed in claim 12 , wherein a through-hole is further formed to pass through the metal layer and the insulation layers surrounding the metal layer, and the plating layer is formed on the inner surface of the through-hole such that the metal layer and the plating layer are integrally formed.

14. The printed circuit board as claimed in claim 13 , wherein shield films are attached to surfaces of the exposure area or a moisture-proof agent is applied to the surfaces of the exposure area.

15. The printed circuit board as claimed in claim 14 , wherein the shield films are polyimide films, the polyimide films having different thicknesses are attached to the opposite surfaces of the exposure area, and the thicknesses of the polyimide films are made to be the same as the polyimide films on one surface of the exposure area becomes thinner when the exposure area is bent and the polyimide films on an opposite surface of the exposure area becomes thicker when the exposure area is bent.

16. A board block for vehicles, comprising:

a housing having an interior space;

a first printed circuit board installed within the housing and having a first area and a second area divided by an exposure area from which a metal layer is exposed such that surfaces of the first and second areas face an inner surface of the housing, wherein a circuit pattern is formed on an insulation layer of the metal layer;

a first connector unit installed in the first area of the first printed circuit board and a tip end of which faces a lower side of the housing; and

a second connector unit installed in the second area of the first printed circuit board and a tip end of which faces the lower side of the housing,

wherein an input connector unit for supplying electric power to the metal layer is installed in the second area of the first printed circuit board.

17. The board block as claimed in claim 16 , further comprising a center board having a first area mounting unit and a second area mounting unit coupled to the first area and the second area of the first printed circuit board, respectively, wherein a second printed circuit board is further installed in the center board and electric power is supplied to the second printed circuit board through a jumper pin installed in the second area.

18. The board block as claimed in claim 17 , wherein a component coupling terminal for coupling to a fuse is installed on one surface of the first area, a first connector terminal constituting the first connector unit is installed on an opposite surface of the first area, and a first circuit pattern for supplying the electric power transferred through the metal layer to the first connector terminal via the fuse is provided, and wherein a microchip is mounted to one surface of the second area to control the electric power transferred through the metal layer, and a second circuit pattern for supplying a control signal output from the microchip to a second connector terminal provided in the second area.