Resin blend for melting process
The present invention relates to a resin blend for a melting process, to a method for manufacturing a resin molding using same, and to a resin molding obtained thereby, the resin blend comprising a first resin and a second resin, wherein the second resin includes a polymer resin having at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic ring having 5 to 40 carbon atoms and an aromatic ring having 6 to 40 carbon atoms, and has, with the first resin, a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s −1 and a processing temperature of the resin mixture, and a glass transition temperature (T g ) difference of 10° C. to 150° C.
1. A resin blend for a melting process comprising a first resin and a second resin,
wherein the first resin comprises an acrylate-based resin,
wherein the second resin comprises a (meth)acrylate-based resin to which at least one organic functional group selected from the group consisting of tertiary butyl group, isobornyl group, cyclohexyl group, and phenyl group is introduced, and has a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s −1 at a processing temperature of the resin blend and a glass transition temperature (T g ) difference of 10° C. to 100° C. with respect to the first resin,
wherein the resin blend forms a layer-separated structure in which the second resin forms on a surface of the first resin in the layer-separated structure during melt processing under shear stress,
wherein the resin blend has an impact resistance of 6.7 to 8.8 kg*cm/cm in an IZOD ⅛″ test and of 6.5 to 9.1 kg*cm/cm in an IZOD ¼″ test measured according to ASTM D256, and
wherein the resin blend has a pencil hardness of 2H to 3H measured according to ASTM 3363-74.
2. The resin blend of claim 1 , wherein the melt viscosity difference between the first resin and the second resin at the shear rate of 100 to 1,000 s −1 at the processing temperature of the resin blend is in a range of 0.1 to 2,000 Pa*s.
3. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having a tertiary butyl group functional group.
4. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having an isobornyl functional group.
5. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having a cyclohexyl functional group.
6. The resin blend of claim 1 , wherein the second resin is a (meth)acrylate-based resin having a phenyl functional group.