Heterojunction semiconductor device with conductive barrier portion and manufacturing method
View Patent ↗Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.
1. A semiconductor device comprising:
a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer;
a first capping layer over the second layer; and
a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction with the first capping layer between the heterojunction and the Schottky electrode and the first further electrode, said Schottky electrode comprising a central region and an edge region, a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode, wherein the conductive barrier portion comprises a second capping layer and wherein underneath the central region of the Schottky electrode is free of the second capping layer and wherein the first capping layer is separated from the second capping layer by an etch stop layer.
2. The semiconductor element of claim 1 , wherein the first layer comprises GaN and the second layer comprises AlGaN.
3. The semiconductor device of claim 1 , further comprising an electrically insulating layer adjacent to the Schottky electrode, wherein the conductive barrier portion has a first portion underneath the edge region of the Schottky electrode and a second portion underneath an edge region of the electrically insulating layer.
4. The semiconductor device of claim 3 , wherein the first portion has a minimum lateral dimension in the range of 50-200 nm.
5. The semiconductor device of claim 1 , wherein the first capping layer and the second capping layer comprise gallium nitride.
6. The semiconductor device of claim 1 , wherein the second capping layer forms raised portions above the first capping layer.
7. The semiconductor device of claim 1 , wherein the first capping layer is a chemically modified portion of at least one of the second capping layer and the second layer.
8. The semiconductor device of claim 1 , wherein the Schottky electrode comprises a second metal and the conductive barrier portion comprises a first metal different to the second metal.
9. The semiconductor device of claim 1 , further comprising a second further electrode conductively coupled to an area of the heterojunction, wherein the Schottky electrode is located in between the first further electrode and the second further electrode.