Integrated circuitry comprising transistors with broken up active regions
Some embodiments include integrated circuits having first and second transistors. The first transistor is wider than the second transistor. The first and second transistors have first and second active regions, respectively. Dielectric features are associated with the first active region and break up the first active region. The second active region is not broken up to the same extent as the first active region. Some embodiments include methods of forming transistors. Active areas of first and second transistors are formed. The active area of the first transistor is wider than the active area of the second transistor. Dielectric features are formed in the active area of the first transistor. The active area of the first transistor is broken up to a different extent than the active area of the second transistor. The active areas of the first and second transistors are simultaneously doped.
1. An integrated circuit, comprising:
first and second transistors; the first transistor being wider than the second transistor;
the first and second transistors comprising first and second active regions, respectively; dielectric features being associated with the first active region and breaking up the first active region; the second active region not being broken up to the same extent as the first active region; and
wherein the second active region is broken up by one or more dielectric features.
2. The integrated circuit of claim 1 wherein the first and second active regions have a same dopant concentration as one another.
3. The integrated circuit of claim 1 wherein the dielectric features include two or more features with length greater than width, and that extend between a gate of the first transistor and a contact region of the first transistor.
4. The integrated circuit of claim 3 wherein the contact region is a drain region.
5. The integrated circuit of claim 1 wherein the dielectric features associated with the first active region are arranged on both sides of a gate of the first transistor, with dielectric features on one side of the gate being a mirror image of dielectric features on an opposing side of the gate.
6. The integrated circuit of claim 1 wherein the dielectric features associated with the first active region are not symmetrically distributed on one side of a gate of the first transistor relative to an opposing side of the gate.
7. An integrated circuit, comprising:
first and second transistors; the first transistor being wider than the second transistor; the first and second transistors being high-voltage transistors;
the first and second transistors comprising first and second active regions, respectively; dielectric features being associated with the first active region and breaking up the first active region; the second active region not being broken up to the same extent as the first active region; and
a third high-voltage transistor having a third active region; the third high-voltage transistor being wider than the first high-voltage transistor; dielectric features being associated with the third active region and breaking up the third active region; the third active region being broken up to a different extent than the first active region.
8. The integrated circuit of claim 7 wherein the high-voltage transistors are electrically coupled to a memory array.
9. The integrated circuit of claim 8 wherein the memory array is a NAND array.
10. The integrated circuit of claim 7 further comprising a fourth transistor less wide than the second transistor and comprising a fourth active region; and wherein the fourth active region is not broken up.