IP Library › Granted Patent US 9,453,106
Granted Patent B2
US 9,453,106 · App. 13/898,099 · Granted Sep 27, 2016

Scratch-resistant, transparent and tough copolyamide moulding compounds, moulded articles produced therefrom and uses thereof

Inventor: Friedrich Severin Buhler (Thusis, CH)
Assignee: EMS-PATENT AG
C08G69/265C08L77/06
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Quick Facts
Patent No.
US 9,453,106
App. No.
13/898,099
Granted
Sep 27, 2016
Kind
B2
Abstract

Disclosed are scratch-resistant, transparent and tough copolyamide molding compounds distinguished by high scratch-resistance, excellent transparency and great toughness, which are suitable for producing transparent moulded articles or transparent coatings. The molding compounds are obtained by polycondensation of a carboxylic acid mixture including at least one aliphatic dicarboxylic acid and at least one aromatic dicarboxylic acid with at least one cycloaliphatic diamine. Also disclosed are molded parts or coatings produced from the copolyamide compounds.

Claims (22)

1. A transparent, scratch-resistant and tough copolyamide moulding compound, producible by polycondensation of a cycloaliphatic diamine or a mixture of two or more cycloaliphatic diamines, wherein said cycloaliphatic diamine or a mixture of two or more cycloaliphatic diamines is selected from the group consisting of 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane (DMDC), 3,3′,5,5′-tetramethyl-4,4′-diaminocyclohexylmethane, 2,2′,3,3′-tetramethyl-4,4′-diaminocyclohexylmethane and norbornanediamine with a carboxylic acid mixture comprising (i) at least one aliphatic dicarboxylic acid with 6 to 18 carbon atoms and (ii) a mixture of isophthalic acid and terephthalic acid, a mixture of isophthalic acid and naphthalene dicarboxylic acid, or a mixture of isophthalic acid and terephthalic acid and naphthalene dicarboxylic acid,

wherein in (ii), the molar ratio of isophthalic acid to terephthalic acid, the molar ratio of isophthalic acid to naphthalene dicarboxylic acid, or the molar ratio of isophthalic acid to terephthalic acid and naphthalene dicarboxylic acid is 5:1 to 1:1.2,

the copolyamide moulding compound having a scratch-resistance of greater than or equal to grade H, measured according to ASTM D3363-05,

wherein the polycondensation is carried out on a polycondensation mixture consisting of a) 15 to 38% by mol of the at least one aliphatic dicarboxylic acid (i) with respect to the total number of moles of the diamine or diamines and the diacids in the polycondensation mixture, b) 12 to 35% by mol of the mixture (ii) of aromatic dicarboxylic acids with respect to the total number of moles of the diamine or diamines and the diacids in the polycondensation mixture, and c) 50% by mol of said diamine or mixture of diamines with respect to the total number of moles of the diamine or diamines and the diacids in the polycondensation mixture.

2. The copolyamide moulding compound according to claim 1 , having a notch impact strength of at least 9 kJ/m 2 .

3. The copolyamide moulding compound according to claim 1 , having a glass transition temperature of at least 165° C.

4. The copolyamide moulding compound according to claim 1 , having a stress-cracking resistance in toluene of at least 15 MPa.

5. The copolyamide moulding compound according to claim 1 , having a breaking elongation of at least 20%.

6. The copolyamide moulding compound according to claim 1 , having a modulus of elasticity in tension of at least 1,700 MPa.

7. The copolyamide moulding compound according to claim 1 , wherein the aliphatic dicarboxylic acid is selected from dicarboxylic acids with 6, 7, 8, 9, 10, 11, 12, 13 or 14 carbon atoms.

8. The copolyamide moulding compound according to claim 1 , producible by polycondensation of 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane (DMIDC) and/or 3,3′,5,5′-tetramethyl-4,4′-diaminocyclohexylmethane with a mixture of 1,12-dodecanoic diacid and a mixture of isophthalic acid and terephthalic acid.

9. The copolyamide moulding compound according to claim 8 , wherein the polycondensation mixture consists of 15 to 38% by mol of 1,12-dodecanoic diacid and 12 to 35% by mol of the mixture of isophthalic acid and terephthalic acid.

10. The copolyamide moulding compound according to claim 8 , wherein the polycondensation mixture consists of:)

20 to 28% by mol of 1,12-dodecanoic diacid, 14 to 25% by mol of isophthalic acid and 5 to 16% by mol of terephthalic acid,

with the proviso that dodecanoic diacid, isophthalic acid and terephthalic acid are chosen such that the result is 50% by mol.

11. A moulded article or a coating comprising a copolyamide moulding compound according to claim 1 .

12. The moulded article according to claim 11 which is selected from the group consisting of correcting lenses, non-correcting lenses, sunglass lenses, spectacle bows, spectacle frames, safety glasses, visors, glasses, glass panes, clock glasses, lamp glass, protective helmets, handles, fasteners, textile fasteners, measuring instruments, flow meters, filter cups, eye protection, decorative parts, magnifying glasses, lens systems, camera lenses, LED lenses, displays, game consoles, cameras, laser devices, distance measuring devices, GPS devices, and apparatus housings.

13. A method for the production of moulded articles or coatings, correcting lenses, non-correcting lenses, sunglass lenses, spectacle bows, spectacle frames, safety glasses, visors, glasses, glass panes, clock glasses, lamp glass, protective helmets, handles, fasteners, textile fasteners, measuring instruments, flow meters, filter cups, eye protection, decorative parts, magnifying glasses, lens systems, camera lenses, LED lenses, displays, game consoles, cameras, laser-, distance measuring- or GPS devices, and apparatus housings comprising utilizing a copolyamide moulding compound in accordance with claim 1 in the manufacture of the articles or coatings.

14. The copolyamide moulding compound according to claim 1 , having a glass transition temperature of 165 to 215° C.

15. The copolyamide moulding compound according to claim 1 , having a stress-cracking resistance in toluene of at least 20 MPa.

16. The copolyamide moulding compound according to claim 1 , having a breaking elongation of at least 30%.

17. The copolyamide moulding compound according to claim 1 , having a modulus of elasticity in tension of at least 1,800 MPa.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2013
From: BUHLER, FREDRICH SEVERIN
To: EMS-PATENT AG
Reel/Frame 031503/0470 →
Priority Claims (1)
EP 12168988 · May 23, 2012 · regional
Continuity (1)
Related Publication 20130317168A1 · Nov 28, 2013