Semiconductor device including oxide semiconductor stack with different ratio of indium and gallium
A highly reliable semiconductor device including an oxide semiconductor is provided by preventing a change in its electrical characteristics. A semiconductor device which includes a first oxide semiconductor layer which is in contact with a source electrode layer and a drain electrode layer and a second oxide semiconductor layer which serves as a main current path (channel) of a transistor is provided. The first oxide semiconductor layer serves as a buffer layer for preventing a constituent element of the source and drain electrode layers from diffusing into the channel. By providing the first oxide semiconductor layer, it is possible to prevent diffusion of the constituent element into an interface between the first oxide semiconductor layer and the second oxide semiconductor layer and into the second oxide semiconductor layer.
1. A semiconductor device comprising:
a gate electrode layer;
a gate insulating layer comprising silicon over the gate electrode layer;
a first oxide semiconductor layer over the gate insulating layer, the first oxide semiconductor layer comprising indium, silicon and gallium;
a second crystalline oxide semiconductor layer over the first oxide semiconductor layer, the second crystalline oxide semiconductor layer comprising indium and gallium;
a source electrode layer over the second crystalline oxide semiconductor layer; and
a drain electrode layer over the second crystalline oxide semiconductor layer,
wherein a content of the indium is higher than a content of the gallium in the first oxide semiconductor layer,
wherein a content of the indium is lower than or equal to a content of the gallium in the second crystalline oxide semiconductor layer,
wherein the second crystalline oxide semiconductor layer comprises at least one element of the source electrode layer and the drain electrode layer, and
wherein an energy gap of the second crystalline oxide semiconductor layer is larger than an energy gap of the first oxide semiconductor layer.
2. The semiconductor device according to claim 1 ,
wherein the source electrode layer and the drain electrode layer contain copper, and
wherein an element of the source electrode layer and the drain electrode layer in the second crystalline oxide semiconductor layer is copper.
3. The semiconductor device according to claim 1 ,
wherein the gate insulating layer includes a silicon nitride film.
4. The semiconductor device according to claim 1 ,
wherein each of the first oxide semiconductor layer and the second crystalline oxide semiconductor layer comprises zinc.
5. The semiconductor device according to claim 1 ,
wherein the semiconductor device is a display device.
6. The semiconductor device according to claim 1 ,
wherein the gate insulating layer includes an oxide insulating layer which contains oxygen in excess of a stoichiometric composition.
7. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor layer has crystallinity.
8. The semiconductor device according to claim 1 ,
wherein the gate insulating layer has a spin density of 1×10 17 . spins/cm 3 or less corresponding to a signal that appears at a g-factor of 2.003 in electron spin resonance spectroscopy.
9. A semiconductor device comprising:
a gate electrode layer;
a gate insulating layer comprising silicon over the gate electrode layer;
a first oxide semiconductor layer over the gate insulating layer, the first oxide semiconductor layer comprising indium, silicon and gallium;
a second oxide semiconductor layer over the first oxide semiconductor layer, the second oxide semiconductor layer comprising indium and gallium;
a third crystalline oxide semiconductor layer over the second oxide semiconductor layer, the third crystalline oxide semiconductor layer comprising indium and gallium;
a source electrode layer in electrical contact with the second oxide semiconductor layer; and
a drain electrode layer in electrical contact with the second oxide semiconductor layer,
wherein a content of the indium is lower than or equal to a content of the gallium in the first oxide semiconductor layer,
wherein a content of the indium is higher than a content of the gallium in the second oxide semiconductor layer,
wherein a content of the indium is lower than or equal to a content of the gallium in the third crystalline oxide semiconductor layer,
wherein the third crystalline oxide semiconductor layer comprises at least one element of the source electrode layer and the drain electrode layer, and
wherein an energy gap of the first oxide semiconductor layer and an energy gap of the third crystalline oxide semiconductor layer are larger than an energy gap of the second oxide semiconductor layer.
10. The semiconductor device according to claim 9 ,
wherein the source electrode layer is over the third crystalline oxide semiconductor layer, and
wherein the drain electrode layer is over the third crystalline oxide semiconductor layer.
11. The semiconductor device according to claim 9 ,
wherein the source electrode layer and the drain electrode layer contain copper, and
wherein an element of the source electrode layer and the drain electrode layer in the third crystalline oxide semiconductor layer is copper.
12. The semiconductor device according to claim 9 ,
wherein the gate insulating layer includes a silicon nitride film.
13. The semiconductor device according to claim 9 ,
wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer and the third crystalline oxide semiconductor layer comprises zinc.
14. The semiconductor device according to claim 9 ,
wherein the semiconductor device is a display device.
15. The semiconductor device according to claim 9 ,
wherein the gate insulating layer includes an oxide insulating layer which contains oxygen in excess of a stoichiometric composition.
16. The semiconductor device according to claim 9 ,
wherein the first oxide semiconductor layer has crystallinity.
17. The semiconductor device according to claim 9 ,
wherein the second oxide semiconductor layer has crystallinity.
18. The semiconductor device according to claim 9 ,
wherein the gate insulating layer has a spin density of 1×10 17 . spins/cm 3 or less corresponding to a signal that appears at a g-factor of 2.003 in electron spin resonance spectroscopy.
19. A semiconductor device comprising:
a gate electrode layer;
a gate insulating layer comprising silicon over the gate electrode layer;
a first oxide semiconductor layer over the gate insulating layer, the first oxide semiconductor layer comprising indium, silicon and gallium;
a second oxide semiconductor layer over the first oxide semiconductor layer, the second oxide semiconductor layer comprising indium and gallium;
a third crystalline oxide semiconductor layer over the second oxide semiconductor layer, the third crystalline oxide semiconductor layer comprising indium and gallium;
a source electrode layer in electrical contact with the second oxide semiconductor layer; and
a drain electrode layer in electrical contact with the second oxide semiconductor layer,
wherein a content of the indium is lower than or equal to a content of the gallium in the first oxide semiconductor layer,
wherein a content of the indium is higher than a content of the gallium in the second oxide semiconductor layer,
wherein a content of the indium is lower than or equal to a content of the gallium in the third crystalline oxide semiconductor layer,
wherein the third crystalline oxide semiconductor layer comprises at least one element of the source electrode layer and the drain electrode layer, and
wherein an energy gap of the first oxide semiconductor layer and an energy gap of the third crystalline oxide semiconductor layer are larger than an energy gap of the second oxide semiconductor layer.
20. The semiconductor device according to claim 19 ,
wherein the source electrode layer is over the third crystalline oxide semiconductor layer, and
wherein the drain electrode layer is over the third crystalline oxide semiconductor layer.
21. The semiconductor device according to claim 19 ,
wherein the source electrode layer and the drain electrode layer contain copper, and
wherein an element of the source electrode layer and the drain electrode layer in the third crystalline oxide semiconductor layer is copper.
22. The semiconductor device according to claim 19 ,
wherein each of the first oxide semiconductor layer, the second oxide semiconductor layer and the third crystalline oxide semiconductor layer comprises zinc.
23. The semiconductor device according to claim 19 ,
wherein the semiconductor device is a display device.
24. The semiconductor device according to claim 19 ,
wherein the gate insulating layer includes an oxide insulating layer which contains oxygen in excess of a stoichiometric composition.
25. The semiconductor device according to claim 19 ,
wherein the first oxide semiconductor layer has crystallinity.
26. The semiconductor device according to claim 19 ,
wherein the second oxide semiconductor layer has crystallinity.
27. The semiconductor device according to claim 19 ,
wherein the gate insulating layer has a spin density of 1×10 17 . spins/cm 3 or less corresponding to a signal that appears at a g-factor of 2.003 in electron spin resonance spectroscopy.