Stable high mobility MOTFT and fabrication at low temperature
A method of fabricating a stable high mobility amorphous MOTFT includes a step of providing a substrate with a gate formed thereon and a gate dielectric layer positioned over the gate. A carrier transport structure is deposited by sputtering on the gate dielectric layer. The carrier transport structure includes a layer of amorphous high mobility metal oxide adjacent the gate dielectric and a relatively inert protective layer of material deposited on the layer of amorphous high mobility metal oxide both deposited without oxygen and in situ. The layer of amorphous metal oxide has a mobility above 40 cm 2 /Vs and a carrier concentration in a range of approximately 10 18 cm −3 to approximately 5×10 19 cm −3 . Source/drain contacts are positioned on the protective layer and in electrical contact therewith.
1. A method of fabricating a stable high mobility amorphous MOTFT comprising the steps of:
providing a substrate with a gate formed thereon and a gate dielectric layer positioned over the gate;
depositing a carrier transport structure on the gate dielectric layer, the carrier transport structure including a layer of amorphous high mobility metal oxide adjacent the gate dielectric and a protective layer of material relatively inert compared to the layer of metal oxide;
forming an oxygen-rich zone adjacent a top surface of the protective layer at approximately room temperature, including coating with an oxygen-rich self-assembled layer comprising one of 4-chlorophenyl trichlorosilane (4-CPTS), chloromethyl trichlorosilane (CMTS), 4-chlorophenyl phosphoric acid (4-CPPA), 3-nitrophenyl phosphonic acid (3-NPPA), 2-chloroethyl phosphonic acid (2-CEPA), or their combination; and
driving oxygen into the protective layer at an elevated temperature below approximately 350° C.
2. The method as claimed in claim 1 further including the steps of:
defining a channel area overlying the gate in the layer of amorphous high mobility metal oxide;
forming an etch-stop layer overlying the channel area subsequent to the driving oxygen step;
defining source/drain contact areas on opposed sides of the channel area;
performing a cleaning and/or treatment and/or etching step on the surface of the source/drain contact areas; and
depositing and patterning source/drain contacts on the protective layer in the source/drain contact areas.
3. The method as claimed in claim 1 further including, prior to the step of forming an oxygen-rich zone, the steps of:
defining a channel area overlying the gate in the layer of amorphous high mobility metal oxide;
defining source/drain contact areas on opposed sides of the channel area;
depositing a blanket metal layer on the protective layer; and
patterning the blanket metal layer to form source/drain electrodes in the source/drain areas and to open an area between the source/drain electrodes overlying the channel area.
4. The method as claimed in claim 1 wherein the step of depositing a layer of amorphous high mobility metal oxide includes depositing a layer of amorphous metal oxide with a mobility above 40 cm 2 /Vs.
5. The method as claimed in claim 1 wherein the step of depositing a layer of amorphous high mobility metal oxide includes depositing a layer of amorphous metal oxide with a carrier concentration in a range of approximately 10 18 cm −3 to approximately 5×10 19 cm −3 .
6. The method as claimed in claim 1 wherein the step of depositing the layer of amorphous high mobility metal oxide includes depositing one of indium-tin-oxide (ITO), indium oxide (InO), tin oxide (SnO), cadmium oxide (CdO), zinc oxide (ZnO) indium-zinc-oxide (IZO), or zinc oxide (ZnO), or a composite film including more than one of the above metal-oxides.
7. The method as claimed in claim 1 wherein the step of depositing the layer of amorphous high mobility metal oxide includes depositing a layer with a thickness in a range of equal to or less than approximately 5 nm.
8. The method as claimed in claim 1 wherein the step of depositing the protective layer includes depositing a layer including metal oxides that are more inert than the amorphous high mobility metal oxide layer.
9. The method as claimed in claim 8 wherein the step of depositing the more inert metal oxide includes depositing a layer of one of M-Zn—O, M-In—O, or their combination, where M includes at least one of Al, Ga, Ta, Ti, Si, Ge, Sn, Mo, W, Cu, V, or Zr.
10. The method as claimed in claim 1 wherein the step of depositing the protective layer includes depositing a layer with a thickness in a range of 20 nm-50 nm.
11. The method as claimed in claim 1 wherein the step of depositing the carrier transport structure includes depositing the layer of amorphous high mobility metal oxide and the protective layer in situ, without a vacuum break.
12. The method as claimed in claim 1 wherein the step of depositing the carrier transport structure includes depositing the layer of amorphous high mobility metal oxide and the protective layer at a temperature below 160° C.
13. The method as claimed in claim 1 wherein the step of depositing the carrier transport structure includes depositing the layer of amorphous high mobility metal oxide and the protective layer by sputtering.
14. The method as claimed in claim 13 wherein the step of depositing the layer of amorphous high mobility metal oxide and the protective layer by sputtering without oxygen.
15. The method as claimed in claim 1 wherein the step of forming the oxygen-rich zone further includes using oxygen plasma, N 2 O plasma, a UV-ozone process, surface treatment with hydrogen-peroxide or a dichromate solution, or a combination process thereof.
16. The method as claimed in claim 15 wherein the step of forming the oxygen-rich zone is performed at a temperature below 160° C.
17. The method as claimed in claim 15 wherein the step of forming the oxygen-rich zone is performed at a pressure below 100 mtorr.
18. The method as claimed in claim 1 wherein the step of driving oxygen from the oxygen source into the protective layer includes using an elevated temperature equal to or greater than 160° C.
19. The method as claimed in claim 1 wherein the step of providing the substrate includes providing a substrate including one of glass, plastic film, and stainless steel film each in one of rigid, conformable, or flexible form.
20. The method as claimed in claim 1 wherein the step of providing the gate dielectric layer includes providing a layer including SiO 2 , SiN, Al 2 O 3 , AlN, Ta 2 O 5 , TiO 2 , ZrO, HfO, SrO, or their combinations in blend or multiple layer form.
21. The method as claimed in claim 20 wherein the step of providing the gate dielectric layer includes forming the gate dielectric layer by anodization, by heating under oxygen-rich ambient, or combinations thereof in sequence from the corresponding metal.
22. A method of fabricating a stable high mobility amorphous MOTFT comprising the steps of:
providing a substrate with a gate formed thereon and a gate dielectric layer positioned over the gate;
depositing by sputtering a carrier transport structure on the gate dielectric layer without intentional substrate heating or with intentional cooling, the carrier transport structure including a layer of amorphous high mobility metal oxide adjacent the gate dielectric and a protective layer of material deposited on the layer of amorphous high mobility metal oxide both deposited without oxygen and in situ, the protective layer being relatively inert compared to the layer of amorphous high mobility metal oxide;
forming an oxygen-rich zone at the upper surface of the protective layer at a temperature below 160° C.
driving oxygen into the protective layer from the oxygen-rich zone at an elevated temperature; and
the resulting layer of amorphous metal oxide having a mobility above 40 cm 2 /Vs and a carrier concentration in a range of approximately 10 18 cm −3 to approximately 5×10 19 cm −3 .
23. The method as claimed in claim 22 further including the steps of:
defining a channel area overlying the gate in the layer of amorphous high mobility metal oxide;
forming an etch-stop layer overlying the channel area subsequent to the driving oxygen step;
defining source/drain contact areas on opposed sides of the channel area;
performing a cleaning and/or treatment and/or etching step on the surface of the source/drain contact areas; and
depositing and patterning source/drain contacts on the protective layer in the source/drain contact areas.
24. The method as claimed in claim 22 further including, prior to the step of forming an oxygen-rich zone, the steps of:
defining a channel area overlying the gate in the layer of amorphous high mobility metal oxide;
defining source/drain contact areas on opposed sides of the channel area;
depositing a blanket metal layer on the protective layer; and
patterning the blanket metal layer to form source/drain electrodes in the source/drain areas and to open an area between the source/drain electrodes overlying the channel area.
25. The method as claimed in claim 22 wherein the step of depositing the layer of amorphous high mobility metal oxide includes depositing a layer with a thickness in a range of equal to or less than approximately 5 nm.
26. The method as claimed in claim 22 wherein the step of depositing the protective layer includes depositing a layer with a thickness in a range of 20 nm-50 nm.