Immersion cooled motor controller

1. An immersion cooled motor controller assembly comprising:

a) a sealed housing with finned heat sinks are provided on exterior surfaces of the housing;

b) a non-conductive cooling liquid including a fluorocarbon contained in the housing; and

c) a motor controller disposed in the housing and submerged in the non-conductive cooling liquid, the motor controller including:

a power board module configured to operate at power levels that are greater than 30 kW, the power board module including:

a printed wire board;

a bank of closely packed, power semiconductor switches coupled to the printed wire board;

a bank of DC link capacitors mounted to the printed wire board; and

active rectifier gate drive circuitry mounted to the printed wire board and operatively connected to the power semiconductor switches;

a bank of differential mode inductors adjacent to the printed wire board; and

a bank of common mode inductors adjacent to the printed wire board,

wherein the differential mode inductors and common mode inductors are constructed from 14 AWG wire.

2. An immersion cooled motor controller assembly as recited in claim 1 , wherein a low density filler material is disposed within the housing to reduce the volume of cooling liquid contained therein.

3. An immersion cooled motor controller assembly as recited in claim 1 , wherein each of the power semiconductor switches includes an individual clip-on heat sink to increase the surface area available for cooling.

4. An immersion cooled motor controller assembly as recited in claim 1 , wherein the motor controller further includes a filter board module and a control board module.

5. An immersion cooled motor controller assembly comprising:

a) a sealed housing with interior and exterior finned heat sinks,

wherein the interior finned heat sinks are provided on lower, upper, and lateral surfaces of interior surfaces of the sealed housing;

b) a fluorocarbon cooling liquid contained in the sealed housing; and

c) a motor controller disposed in the sealed housing and submerged in the fluorocarbon cooling liquid to facilitate nucleated cooling of electronic components of the motor controller, the motor controller including a power board module, having:

a printed wire board;

a plurality of closely packed, vertically mounted power semiconductor switches coupled to the printed wire board;

a bank of DC link capacitors mounted to the printed wire board; and

active rectifier gate drive circuitry mounted to the printed wire board and operatively connected to the power semiconductor switches;

a bank of differential mode inductors adjacent to the printed wire board; and

a bank of common mode inductors adjacent to the printed wire board,

wherein the differential mode inductors and common mode inductors are constructed from 14 AWG wire;

wherein the motor controller has a power density of about 1 kW/lb and/or a volumetric power density of 77 kW/ft 3 .

6. An immersion cooled motor controller assembly as recited in claim 5 , wherein each semiconductor switch has an individual heat sink operatively associated therewith to increase the surface area available for cooling.

7. An immersion cooled motor controller assembly as recited in claim 5 , wherein a low density plastic filler material is disposed within the sealed housing to reduce the volume of cooling liquid contained therein.

8. An immersion cooled motor controller assembly as recited in claim 5 , wherein the motor controller further includes a filter board module and a control board module.

9. An immersion cooled motor controller assembly as recited in claim 5 , wherein the power board module is adapted and configured to operate at power levels greater than 30 kW.

10. An immersion motor controller assembly as recited in claim 5 , further including upper and lower EMI shield plates disposed within the sealed interior and isolating the common mode inductors and differential mode inductors from the power control module.