IP Library › Granted Patent US 9,642,193
Granted Patent B2
US 9,642,193 · App. 13/903,303 · Granted May 2, 2017

Low-oxygen atmosphere apparatus

Inventor: Yuta Kondo (Ichinomiya, JP)
Assignee: DENSO CORPORATION
H05B6/6458B23K1/002B23K1/008B23K1/0012H05B6/6491H05B6/806B23K2203/10H05B2206/044
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Quick Facts
Patent No.
US 9,642,193
App. No.
13/903,303
Granted
May 2, 2017
Kind
B2
Abstract

A low-oxygen atmosphere apparatus including a chamber which houses an object to be processed, microwave generators, and waveguides through which a microwave generated in the microwave generators is transmitted, and further including, in the chamber and/or the waveguides, oxygen-reducing materials to lower the oxygen concentration of the atmosphere in the chamber, which generates heat by the microwave in order to accelerate a reducing reaction of oxygen, thereby lowering the oxygen concentration of the atmosphere in the chamber.

Claims (16)

1. A low-oxygen atmosphere apparatus comprising:

a chamber which houses an object to be process,

microwave generating means,

waveguides through which a microwave generated in the microwave generating means is transmitted to the chamber,

oxygen-reducing materials in the chamber and/or the waveguides, in order to lower the oxygen concentration of the atmosphere in the chamber, by generating heat using the microwave to accelerate a reducing reaction of oxygen, and

a detecting means configured for detecting the oxygen concentration in the chamber,

wherein the microwave generating means contain a microwave output control means configured for controlling microwave output, the microwave output control means being configured to control the microwave output by feeding the oxygen concentration detected by the detecting means back to the microwave output control means.

2. The low-oxygen atmosphere apparatus according to claim 1 , further comprising microwave absorbers, which absorb the microwave, adjacent to the oxygen-reducing materials in the chamber and/or in the waveguides.

3. The low-oxygen atmosphere apparatus according to claim 2 , wherein an affinity of the oxygen-reducing materials to oxygen, and an affinity of the microwave absorbers to oxygen are stronger than an affinity of the object to be processed to oxygen.

4. The low-oxygen atmosphere apparatus according to claim 2 , wherein the oxygen-reducing materials and the microwave absorbers are powdery or fibrous.

5. The low-oxygen atmosphere apparatus according to claim 4 , wherein a powder or fibers which constitute the oxygen-reducing materials, and a powder or fibers which constitute the microwave absorbers are arranged such that they are mixed or in contact with each other.

6. The low-oxygen atmosphere apparatus according to claim 2 , wherein microwave susceptibility of the object to be processed is lower than those of the oxygen-reducing materials and the microwave absorbers.

7. The low-oxygen atmosphere apparatus according to claim 1 , wherein the oxygen-reducing materials also function as a microwave absorber which absorbs the microwave.

8. The low-oxygen atmosphere apparatus according to claim 7 , wherein the affinity of the oxygen-reducing materials to oxygen is stronger than the affinity of the object to be processed to oxygen.

9. The low-oxygen atmosphere apparatus according to claim 7 , wherein the oxygen-reducing materials are powdery or fibrous.

10. The low-oxygen atmosphere apparatus according to claim 7 , wherein the microwave susceptibility of the object to be processed is lower than that of the oxygen-reducing materials.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2013
From: KONDO, YUTA
To: DENSO CORPORATION
Reel/Frame 030502/0072 →
Priority Claims (1)
JP 2012-127194 · Jun 4, 2012 · national
Continuity (1)
Related Publication 20130320001A1 · Dec 5, 2013