Self aligning soldering
A substrate pad for soldering at least one self-aligning component thereon, wherein at least one edge of a body of the substrate pad is shaped to conform to a corresponding edge of a component pad, and the at least one edge of the body of the substrate pad further include a plurality of pad fingers leading away from the substrate pad. Related apparatus and methods are also described.
1. A component and a substrate for soldering the component thereon, comprising:
a component comprising a component pad terminal on the component for soldering onto a substrate pad; and
a substrate comprising a substrate pad for soldering the component thereon, wherein the substrate pad comprises a main body having an oval shape and substrate pad fingers leading away from edges of the main body;
wherein:
the size and area and shape of the component pad is equal to the size and area and shape of the main body of the substrate pad;
the edges of the body of the oval substrate pad are shaped to conform to corresponding edges of the oval component pad; and
a sum of widths of the pad fingers along an edge of the body of the oval substrate pad is smaller than half of a length of the same edge of the body of the oval substrate pad.
2. A component and a substrate for soldering the component thereon, comprising:
a component comprising a component pad terminal on the component for soldering onto a substrate pad; and
a substrate comprising a substrate pad for soldering the component thereon, wherein the substrate pad comprises a main body having a polygonal shape and substrate pad fingers leading away from at least two edges of the main body;
wherein the size and area and shape of the component pad is equal to the size and area and shape of the main body of the substrate pad; and
a sum of widths of the pad fingers along an edge of the main body of the substrate pad is smaller than half of a length of the same edge of the main body of the substrate pad.
3. The substrate of claim 2 in which:
the at least two edges of the body of the substrate pad comprise at least two opposite edges.
4. The substrate of claim 2 in which a width of the pad fingers is smaller than a width of a space between two pad fingers.
5. The substrate of claim 2 in which the substrate pad has room for solder fillets on the pad fingers.
6. The substrate of claim 2 in which there are pad fingers on three edges of the body of the substrate pad.
7. The substrate of claim 2 in which the body of the substrate pad is a rectangle.
8. The substrate of claim 2 in which the at least two edges of the body of the substrate pad comprise at least two adjacent edges.
9. The substrate of claim 2 in which the body of the substrate pad is a rectangle and there are pad fingers on all four edges of the body of the substrate pad.