Copper-based material and method for producing the same
A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
1. A copper-based material, comprising:
a base comprising oxygen-free copper, tough pitch copper, or dilute copper alloys containing 3 ppm to 15 ppm by mass of sulfur, 2 ppm to 30 ppm by mass of oxygen, and 5 ppm to 55 ppm by mass of Ti; and
a surface treatment layer directly disposed on an entirety of a surface of the base, the surface treatment layer consisting of an amorphous layer comprising oxygen and a metal having a higher oxygen affinity than copper, the metal consisting of zinc and a diffusion layer between the amorphous layer and the base, the diffusion layer comprising copper and zinc, or a diffusion layer comprising copper, zinc and oxygen.
2. The copper-based material according to claim 1 , wherein the surface treatment layer has a thickness of 3.0 nm to 0.6 μm.
3. The copper-based material according to claim 1 , wherein the diffusion layer has a thickness of 0.5 μm or less.
4. The copper-based material according to claim 1 , wherein the surface treatment layer is formed in a heat treatment at a temperature of 50° C. to 150° C. for 30 seconds to 60 minutes.
5. The copper-based material according to claim 4 , wherein the surface treatment layer has a thickness in a range of 3.0 nm to 0.6 μm.
6. The copper-based. material according to claim 4 , wherein the heat treatment is performed in a range of 30 seconds to 60 minutes.
7. The copper-based material according to claim 1 , wherein the surface treatment layer has a thickness of 3.0 nm to 0.5 μm.
8. The copper-based material according to claim 1 , wherein the base comprises the oxygen-free copper.
9. The copper-based material according to claim 1 , wherein the base comprises the dilute copper alloys.
10. The copper-based material according to claim 1 , wherein the amorphous layer further comprises copper diffused from the base into the amorphous layer.
11. A copper-based material, comprising:
a base comprising copper; and
a surface treatment layer directly disposed on an entirety of a surface of the base, the surface treatment layer consisting of an amorphous layer comprising oxygen and a metal having a higher oxygen affinity than copper, the metal consisting of zinc and a diffusion layer between the amorphous layer and the base, the diffusion layer comprising copper and zinc, or a diffusion layer comprising copper, zinc and oxygen.