Methods for fabricating integrated circuits with the implantation of fluorine
A method for fabricating an integrated circuit includes forming a first gate electrode structure above a first active region and a second gate electrode structure above a second active region, forming a sacrificial spacer on sidewalls of the first and second gate electrode structures, and forming deep drain and source regions selectively in the first and second active regions by using the sacrificial spacer as an implantation mask. The method further includes forming drain and source extension and halo regions in the first and second active regions after removal of the sacrificial spacer and forming a fluorine implant region in the halo region of the first active region before or after formation of the drain and source extension and halo regions.
1. A method for fabricating an integrated circuit comprising:
forming a first gate electrode structure above a first active region and a second gate electrode structure above a second active region;
forming a first spacer on sidewalls of the first and second gate electrode structures and a second spacer on sidewalls of the second gate electrode structure;
forming deep drain and source regions selectively in the second active region by using the second spacer as an implantation mask;
forming drain and source extension and halo regions in the first and second active regions after removal of the second spacer;
forming a third spacer on sidewalls of the first gate electrode structure; and
forming a fluorine implant region in the first active region after formation of the drain and source extension and halo regions and after formation of the third spacer,
wherein forming the fluorine implant region comprises forming a fluorine implant region with a concentration of about 4.0E14 atoms per square centimeter to about 1.0E15 atoms per square centimeter, and
wherein forming the fluorine implant region comprises implanting fluorine at an energy of about 8 to about 10 keV.
2. The method of claim 1 , wherein forming the fluorine implant region comprises ionizing elemental fluorine for implantation into the first active region.
3. The method of claim 1 , wherein forming the fluorine implant region comprises forming a fluorine implant region with a concentration of about 7.0E14 atoms per square centimeter.
4. The method of claim 1 , wherein the first gate electrode structure is an NMOS device.
5. The method of claim 1 , wherein the second gate electrode structure is a PMOS device.
6. The method of claim 1 , wherein the source/drain region of the NMOS device are formed so as to have a different lateral offset as compared to the PMOS device.
7. The method of claim 1 , wherein the source/drain regions of the NMOS device are formed so as to have the same lateral offset as compared to the PMOS device.
8. The method of claim 1 , wherein the first and second gate electrode structures comprise high-k metal gate devices.
9. A method for fabricating an integrated circuit comprising:
forming a first gate electrode structure above a first active region and a second gate electrode structure above a second active region;
forming a first spacer on sidewalls of the first and second gate electrode structures and a second spacer on sidewalls of the second gate electrode structure;
forming deep drain and source regions selectively in the second active region by using the second spacer as an implantation mask;
forming drain and source extension and halo regions in the first and second active regions after removal of the second spacer;
forming a third spacer on sidewalls of the first gate electrode structure; and
forming a fluorine implant region in the first active region after formation of the drain and source extension and halo regions and after formation of the third spacer.