Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece
View Patent ↗A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip includes executing a relative movement between the workpiece and a wire gang of a wire saw with the aid of a forward feed device with a defined forward feed rate so as to slice the wafers. The forward feed rate is varied through the course of the method and includes being set to a value v 1 at a cutting depth of 50% of the workpiece diameter. Subsequently, the forward feed rate is to a value v 2 >1.15×v 1 as the forward feed rate passes through a local maximum. The forward feed rate is set to a value v 3 <v 1 when the wire gang first comes into contact with the sawing strip. The forward feed rate is increased to a value v 5 >v 3 .
1. A method for simultaneously slicing a multiplicity of wafers from a substantially circular-cylindrical workpiece that is connected to a sawing strip, the method comprising:
executing a relative movement between the workpiece and a wire gang of a wire saw in a direction perpendicular to a longitudinal axis of the workpiece with the aid of a forward feed device with a defined forward feed rate, by which the workpiece is guided through the wire gang so as to be sliced into a plurality of wafers; and
varying the forward feed rate through the course of the method including:
setting the forward feed rate to a value v 1 at a cutting depth of 50% of the workpiece diameter;
after reaching the cutting depth of 50% , increasing the forward feed rate to a value v 2 ≧1.15×v 1 as a local maximum;
subsequently to increasing the forward feed rate to the local maximum, decreasing the forward feed rate to a value v 3 <v 1 at a time when the wire gang first comes into contact with the sawing strip; and
subsequent to coming into contact with the sawing strip, increasing the forward feed rate to a value v 5 >v 3 .
2. The method as recited in claim 1 , wherein the forward feed rate has a local minimum at a cutting depth of from 40 to 60% of the workpiece diameter.
3. The method as recited in claim 2 , wherein an xy-plot of the forward feed rate (y)as a function of cutting depth percent (x), has a symmetrical profile with respect to the local minimum in a cutting depth range from 30 to 70% of the workpiece diameter.
4. The method as recited in claim 3 , wherein the xy-plot has a symmetrical profile with respect to the local minimum in a cutting depth range from 25% to 75% of the workpiece diameter.
5. The method as recited in claim 1 , wherein v 2 ≧1.2×v 1 .
6. The method as recited in claim 5 , wherein v 2 ≧1.25×v 1 .
7. The method as recited in claim 1 , wherein v 3 ≦0.9×v 1 .
8. The method as recited in claim 1 , wherein the forward feed rate has a value v 4 at the time when the wire gang emerges from the workpiece, wherein v 3 <v 4 <v 5 .
9. The method as recited in claim 1 , wherein V 5 >V 2 .
10. The method as recited in claim 1 , wherein an xy-plot of the forward feed rate (y) as a function of a cutting depth percent (x) includes a local minimum at the value v 1 and a local maximum at the value v 2 along the cutting depth percent, and
wherein the xy-plot has a mirror-symmetrical profile about the local minimum in a cutting depth range from 30% to 70% of the workpiece diameter.
11. The method as recited in claim 1 , wherein an xy-plot of the forward feed rate (y) as a function of a cutting depth percent (x) includes a local minimum at the value v 1 and a local maximum at the value v 2 along the cutting depth percent, and
wherein the xy-plot has a mirror-symmetrical profile about the local minimum in a cutting depth range from 25% to 75% of the workpiece diameter.
12. The method as recited in claim 2 , wherein the forward feed rate decreases in a cutting depth range of from 30% to 50% of the workpiece diameter.
13. The method as recited in claim 2 , wherein the forward feed rate increases in a cutting depth range of from 50% to 70% of the workpiece diameter.
14. The method as recited in claim 2 , wherein the forward feed rate decreases in a cutting depth range of from 30% to 50% of the workpiece diameter, and
wherein the forward feed rate increases in a cutting depth range of from 50% to 70% of the workpiece diameter.
15. The method as recited in claim 3 , wherein the forward feed rate decreases in a cutting depth range of from 25% to 50% of the workpiece diameter.
16. The method as recited in claim 3 , wherein the forward feed rate increases in a cutting depth range of from 50% to 75% of the workpiece diameter.
17. The method as recited in claim 3 , wherein the forward feed rate decreases in a cutting depth range of from 25% to 50% of the workpiece diameter, and
wherein the forward feed rate increases in a cutting depth range of from 50% to 75% of the workpiece diameter.