IP Library Granted Patent US 9,202,961
Granted Patent B2
US 9,202,961 · App. 13/910,358 · Granted Dec 1, 2015

Imaging devices with solid-state radiation detector with improved sensitivity

Inventors: Henry Chen (Victoria, CA); Salah Awadalla (Victoria, CA); Pinghe Lu (Victoria, CA); Pramodha Marthandam (Victoria, CA)
Assignee: REDLEN TECHNOLOGIES
H01L31/085G01N23/046G01T1/241H01L27/14618H01L27/14658H01L31/0224H01L31/1832H01L2924/0002Y02E10/50
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Quick Facts
Patent No.
US 9,202,961
App. No.
13/910,358
Granted
Dec 1, 2015
Kind
B2
Abstract

A radiation detector includes a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of the semiconductor substrate configured so as to receive radiation, and a plurality of anode electrodes formed on the rear surface of said semiconductor substrate. A work function of the cathode electrode material contacting the front surface of the semiconductor substrate is lower than a work function of the anode electrode material contacting the rear surface of the semiconductor substrate.

Claims (43)

1. An x-ray radiation detector comprising:

a semiconductor substrate having opposing front and rear surfaces;

a cathode electrode located on the front surface of said semiconductor substrate configured so as to receive x-ray radiation; and

a plurality of anode electrodes formed on the rear surface of said semiconductor substrate;

wherein a work function of the cathode electrode material contacting the front surface of the semiconductor substrate is lower than a work function of the anode electrode material contacting the rear surface of the semiconductor substrate;

wherein the plurality of anode electrodes are configured as pixels with an interpixel gap between each two adjacent anode electrode pixels; and

wherein said interpixel gap width is between 300 and 500 μm.

2. The detector of claim 1 , wherein the x-ray radiation detector is part of a computed tomography scanning device.

3. The detector of claim 2 , wherein the x-ray radiation detector is coupled with an x-ray radiation source.

4. The detector of claim 3 , wherein the x-ray radiation source and x-ray radiation detector are mounted on a rotatable gantry.

5. The detector of claim 3 , wherein the x-ray radiation detector is stationary and the x-ray radiation source is mounted on a movable gantry.

6. The detector of claim 1 , wherein the work function of the cathode electrode material is less than about 4.5 eV, and the work function of the anode electrode material is greater than or equal to about 4.8 eV.

7. The detector of claim 1 , wherein the cathode electrode material comprises one of In, Al, and Ti.

8. The detector of claim 1 , wherein the anode electrode material comprises one of Au and Pt.

9. The detector of claim 1 , wherein the semiconductor substrate comprises CdTe or CZT, and the substrate lacks a p-n or p-i-n junction.

10. The detector of claim 1 , further comprising an electrically conductive housing located in electrical contact with the cathode electrode.

11. The detector of claim 1 , further comprising a voltage source electrically connected to the anode and the cathode electrodes.

12. The detector of claim 1 , further comprising a means for applying a forward bias to the detector during operation such that the plurality of anode electrodes is maintained at a higher potential than the cathode electrode and such that a signal is collected from the anode electrodes.

13. The detector of claim 1 , wherein the x-ray radiation detector is part of a security screening device.

14. The detector of claim 13 , wherein the detector further comprises an x-ray radiation source.

15. A method of operating an x-ray radiation detector, comprising:

providing an x-ray radiation detector comprising:

a semiconductor substrate having opposing front and rear surfaces;

a cathode electrode located on the front surface of said semiconductor substrate configured so as to receive x-ray radiation; and

a plurality of anode electrodes formed on the rear surface of said semiconductor substrate,

wherein a work function of the cathode electrode material contacting the front surface of the semiconductor substrate is lower than a work function of the anode electrode material contacting the rear surface of the semiconductor substrate;

receiving x-ray radiation at the cathode electrode;

applying a forward bias to detector to maintain the anode electrodes at a higher potential than the cathode electrode; and

collecting a signal from the anode electrodes;

wherein the plurality of anode electrodes are configured as pixels with an interpixel gap between each two adjacent anode electrode pixels and the signal comprises a measured current or voltage which corresponds to the radiation received at each pixel; and

wherein said interpixel gap width is between 300 and 500 μm.

16. The method of claim 15 , wherein the x-ray radiation detector is part of a computed tomography scanning device.

17. The method of claim 16 , wherein the x-ray radiation detector is coupled with an x-ray radiation source and receiving x-ray radiation comprises receiving x-ray radiation from the x-ray radiation source which passes through a patient.

18. The method of claim 17 , further comprising rotating a rotatable gantry, and wherein the x-ray radiation source and x-ray radiation detector are mounted on the rotatable gantry and rotate about the patient.

19. The method of claim 17 , further comprising moving a mobile gantry supporting the x-ray radiation source in an arc about the patient while the x-ray radiation detector remains stationary.

20. The method of claim 15 , wherein the work function of the cathode electrode material is less than about 4.5 eV, and the work function of the anode electrode material is greater than or equal to about 4.8 eV.

21. The method of claim 15 , wherein the cathode electrode material comprises one of In, Al, and Ti, the anode electrode material comprises one of Au and Pt, and the semiconductor substrate comprises CdTe or CZT.

22. The method of claim 15 , wherein said forward bias injects electrons from said cathode electrode material into the front surface of the semiconductor substrate.

23. The method of claim 15 , wherein the x-ray radiation detector is part of a security screening device.

24. The method of claim 23 , further comprising:

passing an object on a conveyor belt; and

irradiating the object with x-ray radiation from an x-ray source, wherein receiving x-ray radiation at the cathode electrode comprises receiving x-ray radiation at the cathode electrode from the x-ray source that passed through the object.

25. The method of claim 23 , wherein the x-ray radiation detector is configured to detect gamma radiation and generate an alarm if greater than a predetermined amount of gamma radiation is detected.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2023
From: THE BUSINESS DEVELOPMENT BANK OF CANADA
To: REDLEN TECHNOLOGIES INC.
Reel/Frame 063170/0719 →
SECURITY INTEREST Recorded Apr 15, 2020
From: REDLEN TECHNOLOGIES INC.
To: BUSINESS DEVELOPMENT BANK OF CANADA
Reel/Frame 052407/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2015
From: CHEN, HENRY; AWADALLA, SALAH; LU, PINGHE; MARTHANDAM, PRAMODHA
To: REDLEN TECHNOLOGIES
Reel/Frame 036696/0512 →
Continuity (2)
Continuation In Part 12364042 · Feb 2, 2009
Related Publication 20130266114A1 · Oct 10, 2013