Nanoparticle composition and methods of making the same
A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N′-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; heating a reducing agent solution that includes a reducing agent, an N,N′-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N′-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100° C. to about 200° C. A surfactant system for the stabilizing copper nanoparticles includes an N,N′-dialkylethylenediamine and a C6-C18 alkylamine.
1. A method comprising:
providing a copper salt solution comprising a copper (II) salt, an N,N′-dialkylethylenediamine, a C6-C18 alkylamine, and a first organic solvent;
wherein the N,N′-dialkylethylenediamine comprises branched alkyl groups;
providing a reducing agent solution comprising a reducing agent and a second organic solvent; and
combining the copper salt solution with the reducing agent solution, thereby reducing the copper (II) salt to produce copper nanoparticles having a surfactant coating thereon comprising at least the N,N′-dialkylethylenediamine.
2. The method of claim 1 , wherein combining the copper salt solution with the reducing agent solution comprises adding the copper salt solution to the reducing agent solution.
3. The method of claim 1 , wherein the reducing agent solution also comprises an N,N′-dialkylethylenediamine and a C6-C18 alkylamine.
4. The method of claim 1 , wherein the copper salt solution and the reducing agent solution are heated to a temperature between about 30° C. to about 50° C. prior to being combined.
5. The method of claim 4 , wherein the copper salt solution and the reducing agent solution are heated to a temperature between about 30° C. to about 50° C. while being combined.
6. The method of claim 1 , wherein the C6-C18 alkylamine comprises a C7-C10 alkylamine.
7. The method of claim 1 , wherein the first and second organic solvents are anhydrous.
8. The method of claim 1 , wherein the copper (II) salt is selected from the group consisting of copper (II) chloride, copper (II) bromide, copper (II) iodide, copper (II) nitrate, copper (II) acetate, copper (II) sulfate, copper (II) formate, and copper (II) oxide.
9. The method of claim 1 , wherein the first and second organic solvents comprise triglyme.
10. The method of claim 1 , wherein the reducing agent comprises sodium borohydride.
11. The method of claim 1 , wherein the copper nanoparticles range from about 1 nm to about 10 nm in size.
12. A method comprising:
providing a copper salt solution comprising a copper (II) salt, an N,N′-dialkylethylenediamine, a C6-C18 alkylamine, and a first organic solvent;
wherein the N,N′-dialkylethylenediamine comprises N,N′-di-t-butylethylenediamine;
providing a reducing agent solution comprising a reducing agent and a second organic solvent; and
combining the copper salt solution with the reducing agent solution, thereby reducing the copper (II) salt to produce copper nanoparticles having a surfactant coating thereon comprising at least the N,N′-dialkylethylenediamine.
13. A method comprising:
providing a copper salt solution comprising a copper (II) salt, an N,N′-dialkylethylenediamine, a C6-C18 alkylamine, and a first organic solvent;
providing a reducing agent solution comprising a reducing agent and a second organic solvent; and
combining the copper salt solution with the reducing agent solution, thereby reducing the copper (II) salt to produce copper nanoparticles having a surfactant coating thereon comprising at least the N,N′-dialkylethylenediamine;
wherein the surfactant coating further comprises the C6-C18 alkylamine.