Probe card analysis system and method
A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.
1. A method of testing a probe card outside of a wafer test cell, comprising:
identifying a spring constant for at least one component of a wafer test cell;
determining from at least the identified spring constant at least one force that may be applied to a probe card; and
applying the determined at least one force to the probe card while testing the probe card outside of a wafer test cell such that during the step of testing, the probe card exhibits a characteristic that results at least in part from the applied at least one force indicative of performance of the probe card when operated upon within a wafer test cell.
2. The method of claim 1 , wherein the at least one component includes one of a test head, a probe card, a probe array, a probe head plate and a probe chuck.
3. The method of claim 1 , further comprising:
measuring deflection of the probe card based on the applied forces.
4. The method of claim 1 , further comprising:
measuring a shape of the probe card based on the applied forces.
5. The method of claim 1 , wherein identifying further comprises identifying a spring constant for each of a plurality of components of the wafer test cell.
6. The method of claim 5 , wherein the plurality of components includes at least two of a test head, a probe card, a probe array, and probe head plate and a probe chuck.
7. A method of testing a probe card outside of a probe array analyzer module, comprising:
identifying a spring constant for at least one component of a probe array analyzer module apart from a probe card of a probe array analyzer module;
determining from at least the identified spring constant at least one force that may be applied to the probe card; and
applying the determined at least one force to the probe card while testing the probe card outside of a probe array analyzer module such that during the step of testing, the probe card exhibits a characteristic that results at least in part from the applied at least one force indicative of performance of the probe card when operated upon within a probe array analyzer module.
8. The method of claim 7 , wherein the at least one component includes one of a probe card interface and probe card analyzer hardware.
9. The method of claim 7 , further comprising:
measuring deflection of the probe card based on the applied forces.
10. The method of claim 7 , further comprising:
measuring a shape of the probe card based on the applied forces.
11. The method of claim 7 , wherein identifying further comprises identifying a spring constant for each of a plurality of components of the probe array analyzer module.
12. The method of claim 11 , wherein the plurality of components includes at least two of a probe card interface, a probe card, a probe array and probe card analyzer hardware.