IP Library › Granted Patent US 9,111,681
Granted Patent B2
US 9,111,681 · App. 13/923,585 · Granted Aug 18, 2015

Thin film capacitor

Inventors: Hitoshi Saita (Tokyo, JP); Yoshihiko Yano (Tokyo, JP); Yasunobu Oikawa (Tokyo, JP)
Assignee: TDK Corporation
H01G4/008H01G4/01H01G4/33H01L28/60
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Quick Facts
Patent No.
US 9,111,681
App. No.
13/923,585
Granted
Aug 18, 2015
Kind
B2
Abstract

A thin film capacitor includes a lower electrode layer, a dielectric layer that is provided on said lower electrode layer, and an upper electrode layer that is formed on the dielectric layer. Wherein, the lower electrode layer contains at least a Ni electrode layer, the upper electrode layer configured with at least two layers of a Ni electrode layer and a Cu electrode layer, and the dielectric layer is in contact with both the Ni electrode layer of the lower electrode layer and the Ni electrode layer of the upper electrode layer.

Claims (28)

1. A thin film capacitor, comprising:

a lower electrode layer;

a dielectric layer that is provided on said lower electrode layer; and

an upper electrode layer that is formed on the dielectric layer;

wherein

the lower electrode layer contains at least a Ni electrode layer,

the upper electrode layer configured with at least two layers of a Ni electrode layer and a Cu electrode layer, and

the dielectric layer is in contact with both the Ni electrode layer of the lower electrode layer and the Ni electrode layer of the upper electrode layer.

2. The thin film capacitor according to claim 1 , wherein

the Ni electrode layer of the upper electrode layer has a granular structure, and

the Cu electrode layer of the upper electrode layer has a columnar structure.

3. The thin film capacitor according to claim 2 , wherein

the Ni electrode layer of the upper electrode layer has a thickness of 0.1 μm or more and 2.0 μm or less.

4. The thin film capacitor according to claim 2 , wherein

the dielectric layer is a barium titanate system dielectric material.

5. The thin film capacitor according to claim 2 , wherein the lower electrode layer is a Ni metal foil.

6. The thin film capacitor according to claim 1 , wherein

the Ni electrode layer of the upper electrode layer has a thickness of 0.1 μm or more and 2.0 μm or less.

7. The thin film capacitor according to claim 6 , wherein

the dielectric layer is a barium titanate system dielectric material.

8. The thin film capacitor according to claim 6 , wherein

the lower electrode layer is a Ni metal foil.

9. The thin film capacitor according to claim 1 , wherein

the dielectric layer is a barium titanate system dielectric material.

10. The thin film capacitor according to claim 9 , wherein

the lower electrode layer is a Ni metal foil.

11. The thin film capacitor according to claim 1 , wherein

the lower electrode layer is a Ni metal foil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2013
From: SAITA, HITOSHI; YANO, YOSHIHIKO; OIKAWA, YASUNOBU
To: TDK CORPORATION
Reel/Frame 030660/0086 →
Priority Claims (1)
JP 2012-141019 · Jun 22, 2012 · national
Continuity (1)
Related Publication 20130342960A1 · Dec 26, 2013